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Modified hexagonal boron nitride, prepreg, epoxy resin thermal conductivie composite material, copper clad laminate as well as preparation method and application of prepreg

A technology of hexagonal boron nitride and prepreg, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve problems such as the decline in mechanical properties of composite materials, achieve high thermal conductivity, good mechanical properties, and improve Dispersion effect

Active Publication Date: 2019-05-21
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, there is a polymer barrier between low-content thermally conductive fillers. Only when the amount of thermally conductive filler added reaches more than 50%, can the thermal conductivity of the material be significantly improved, but the mechanical properties of the composite material will be greatly reduced.

Method used

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  • Modified hexagonal boron nitride, prepreg, epoxy resin thermal conductivie composite material, copper clad laminate as well as preparation method and application of prepreg
  • Modified hexagonal boron nitride, prepreg, epoxy resin thermal conductivie composite material, copper clad laminate as well as preparation method and application of prepreg
  • Modified hexagonal boron nitride, prepreg, epoxy resin thermal conductivie composite material, copper clad laminate as well as preparation method and application of prepreg

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] This embodiment provides a modified hexagonal boron nitride, a prepreg, a glass fiber-reinforced epoxy resin heat-conducting composite material, and a copper-clad board. Prepared by the following preparation method.

[0068] (1) Preparation of modified hexagonal boron nitride

[0069] Ultrasonically disperse 100 parts of boron nitride (BN) in 750 parts of dihydromyricetin-ethanol solution with a mass concentration of 50 mg / ml, stir at room temperature for 24 hours, filter, and dry under vacuum at 70°C for 12 hours to obtain dihydromyricetin Myricetin modified boron nitride BN@DMY.

[0070] BN@DMY was heat-treated at 200 °C for 6 h to obtain heat-treated modified hexagonal boron nitride, which was denoted as ht-BN@DMY.

[0071] figure 1 It is the infrared spectrogram of BN, DMY, BN@DMY and ht-BN@DMY in Example 1. It can be seen from the figure that the BN@DMY and ht-BN@DMY modified by dihydromyricetin are at 1643cm -1 and 3300cm -1 There are C=O stretching vibratio...

Embodiment 2

[0080] This embodiment provides a modified hexagonal boron nitride, a prepreg, a glass fiber-reinforced epoxy resin heat-conducting composite material, and a copper-clad board. Prepared by the following preparation method.

[0081] (1) Preparation of modified hexagonal boron nitride

[0082] Ultrasonically disperse 100 parts of boron nitride (BN) in 1000 parts of dihydromyricetin-ethanol solution with a mass concentration of 90 mg / ml, stir at room temperature for 24 hours, filter, and dry under vacuum at 70°C for 12 hours to obtain dihydromyricetin Myricetin modified boron nitride BN@DMY.

[0083] BN@DMY was heat-treated at 200 °C for 6 h to obtain heat-treated modified hexagonal boron nitride, which was denoted as ht-BN@DMY.

[0084] (2) Preparation of prepreg

[0085] The preparation process of the prepreg is the same as in Example 1.

[0086] (3) Glass fiber reinforced epoxy resin thermally conductive composite material

[0087] The preparation process of the glass fib...

Embodiment 3

[0092] This embodiment provides a modified hexagonal boron nitride, a prepreg, a glass fiber-reinforced epoxy resin heat-conducting composite material, and a copper-clad board. Prepared by the following preparation method.

[0093] (1) Preparation of modified hexagonal boron nitride

[0094] Ultrasonically disperse 100 parts of boron nitride (BN) in 500 parts of dihydromyricetin-ethanol solution with a mass concentration of 10 mg / ml, stir at room temperature for 24 hours, filter, and dry under vacuum at 70°C for 12 hours to obtain dihydromyricetin Myricetin modified boron nitride BN@DMY.

[0095] BN@DMY was heat-treated at 200 °C for 4 h to obtain heat-treated modified hexagonal boron nitride, which was denoted as ht-BN@DMY.

[0096] (2) Preparation of prepreg

[0097] The preparation process of the prepreg is the same as in Example 1.

[0098] (3) Preparation of glass fiber reinforced epoxy resin thermally conductive composites

[0099] The preparation process of the gla...

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Abstract

The invention relates to modified hexagonal boron nitride, a prepreg, an epoxy resin thermal conductive composite material, a copper clad laminate as well as a preparation method and application of the prepreg. The modified hexagonal boron nitride is prepared by the following method: S1, carrying out ultrasonic dispersion on hexagonal boron nitride and dispersing into a dihydromyricetin solution,stirring, filtering and drying to obtain dihydromyricetin modified hexagonal boron nitride BN@DMY; and S2, carrying out heat treatment on the BN@DMY at 200 to 250 DEG C for 4 to 6 hours to obtain themodified hexagonal boron nitride. The modified hexagonal boron nitride disclosed by the invention is prepared by utilizing dihydromyricetin to modify and carrying out heat treatment; the dispersity ofboron nitride in epoxy resin can be greatly improved; when the modified hexagonal boron nitride served as thermal conductive filler is added into the prepreg, the epoxy resin thermal conductive composite material and the copper clad laminate, a small amount of the added filler can effectively improve thermal conductivity of the prepreg, the composite material and the copper clad laminate; and inaddition, the mechanical properties of the composite material and the copper clad laminate are high.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic components, and in particular relates to a modified hexagonal boron nitride, a prepreg, an epoxy resin heat-conducting composite material, a copper-clad laminate, and a preparation method and application thereof. Background technique [0002] With the rapid development of the electronics industry, people have put forward higher requirements for the miniaturization of electronic components, but as the volume becomes smaller, its power density is also getting higher and higher, which leads to the generation of electronic components during operation. More heat is difficult to dissipate in time, heat accumulation will easily reduce the use efficiency of the product, and at the same time shorten the service life of the product to a certain extent. Therefore, improving the heat dissipation of electronic products has become a key technical problem to be solved urgently. As the car...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/04C08K9/00C08K3/38C08L63/00B32B27/38B32B27/06B32B17/04B32B15/20B32B15/092B32B33/00
Inventor 肖华容敏智章明秋
Owner SUN YAT SEN UNIV
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