Pulsating heat pipe with tilt-angle communicating pipe structure

Abstract

The invention discloses a pulsating heat pipe with a tilt-angle communicating pipe structure. The pulsating heat pipe structurally comprises a vacuum-pumping/medium-injecting section, an evaporating section with an inclined communicating pipe, a heat insulating section and a condensing section with the inclined communicating pipe, wherein the inclined communicating pipe is additionally arranged on the traditional evaporating section for communicating two adjacent straight pipes in the evaporating section. One part of evaporated gas enters the inclined communicating pipe while passing through the inclined communicating pipe, so that transfer of evaporated gas to the condensing section is quickened to avoid a dry-out phenomenon. Meanwhile, due to the inclined communicating pipe, the evaporation area is increased, so that the pulsating heat pipe is easier to start. The inclined communicating pipe is additionally arranged on the conventional condensing section for communicating two adjacent straight pipes in the condensing section. One part of the condensed medium flows into the inclined communicating pipe while passing through the inclined communicating pipe, so that the condensed medium enters next-round condensation to the evaporating section quicker; in the evaporating section and the condensing section, an included angle between the inclined communicating pipe and a main channel thereof can be the same and also can different, so that the heat transfer property of the pulsating heat pipe is reinforced, and the start-up time of the pulsating heat pipe is shortened.

Description

Technical field [0001] The invention relates to a pulsating heat pipe with a connected pipe with an inclination angle, which belongs to the field of electronic device cooling and high-efficiency heat transfer. Background technique [0002] With the rapid development of the electronics industry, the performance of electronic devices is getting better and better, and the degree of integration is getting higher and higher, and the power per unit area of ​​the electronic components is correspondingly larger and larger. At the end of the 1990s, the heat flux density that the computer mainframe chip can generate has reached 100W / cm 2 . For the small internal space of electronic devices, such a high heat flux density will cause the electronic devices to generate local or overall high temperature, which will reduce the performance of the electronic equipment at a minimum, and cause thermal deformation, causing fatigue damage or failure of the electronic components. According to statisti...

AI Technical Summary

Problems solved by technology

[0004] Although the pulsating heat pipes in the prior art have the above-mentioned advantages, the disadvantages are that the pulsating heat pipes are difficult to start at lower loads, and are easy to dry out at higher loads.

These problems lead to ordinary pulsating heat pipes can only work normally in a small range, thereby reducing their heat transfer characteristics and affecting the normal work and life of electronic components

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