Data correction device, drawing device, inspection device, data correction method, drawing method, inspection method, and recording medium

Abstract

The invention relates to a data correcting apparatus, a drawing apparatus, an inspection apparatus, a data correcting method, a drawing method, an inspection method and a recording medium. The etching characteristic storage part of the data correcting apparatus stores the etching characteristic of each of a plurality of object positions on an object as an object etching characteristic. A characteristic set acquisition part divides the plurality of object positions into a specific number of characteristic groups through storing the object positions which correspond with mutually similar object etching characteristics into one characteristic group, wherein the specific number is smaller than the number of the plurality of object positions. A dividing data correction part divides designing data of a pattern which is formed on the object through etching to a plurality of divided data that correspond with the plurality of dividing areas on the object. Furthermore each divided data are corrected based on the etching characteristic which represents one characteristic group affliated to an object position that is closest to the dividing area that corresponds with the divided data. Therefore, high-precision etching correction can be performed.

Description

technical field [0001] The present invention relates to a technique for correcting design data of a pattern formed on an object by etching. Background technique [0002] Conventionally, in the manufacturing process of semiconductor substrates, printed circuit boards, or glass substrates for plasma display devices or liquid crystal display devices (hereinafter referred to as "substrates"), various treatments are performed on the substrates. For example, a wiring pattern is formed on a substrate by etching a substrate having a resist pattern formed on its surface. In this etching, the shape of the pattern formed on the substrate may differ from the design data due to the density of the pattern arrangement, the size of the pattern, and the like. [0003] Japanese Patent No. 3074675 discloses a technique in which a resist pattern is formed on a substrate by using an electron beam direct drawing device, and then etched by a plasma etching device to form the pattern. In addition...

AI Technical Summary

Problems solved by technology

In this case, it is conceivable to obtain etching characteristics for each part and perform data correction (etching correction) based on the etching characteristics, but it takes a long time to perform etching correction for all parts.

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