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Shielding structure of electronic components against electromagnetic interference

An anti-electromagnetic interference, electronic component technology, applied in electrical components, magnetic field/electric field shielding, cooling/ventilation/heating transformation, etc., can solve the problems of increased heat, reduced efficiency, and short life of electronic components

Active Publication Date: 2019-09-20
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in fact, when electronic components are operated or used, in addition to generating electromagnetic waves, in actual use, electronic components will still generate heat during operation. This heat is gathered in the housing and cannot be dissipated outward. The heat conduction speed of the shielding structure is too slow, that is, the cover cannot effectively transfer the heat generated by the electronic components to the outside, which will cause the heat generated by the electronic components to continue to increase, resulting in the short life of the electronic components covered by the cover. Reduced performance

Method used

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  • Shielding structure of electronic components against electromagnetic interference
  • Shielding structure of electronic components against electromagnetic interference
  • Shielding structure of electronic components against electromagnetic interference

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Embodiment Construction

[0050] Below with reference to drawing, explain the embodiment of the present invention in detail:

[0051] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

[0052] see Figure 1A and Figure 1B and Figure 1C As shown, it is the three-dimensional decomposition, three-dimensional combination and combined cross-sectional view of the first preferred embodiment of the shielding structure of the present invention. As shown in the figure, the shielding structure of the present invention includes a cover 2 and at least one heat transfer element 3, wherein the cover The body 2 is made of anti-electromagnetic wave material, and its anti-electromagnetic wave material includes metal, and the cover body 2 has a first side 21 and a second side 22 opposite to the first side 21, wherein the first side 21 is used in this embodiment It is presented in...

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Abstract

The invention discloses a shielding structure for preventing an electronic component from electromagnetic interference. The shielding structure is provided with a cover body, the at least one heat transfer element is attached to a first-side position of the cover body, and at least one electronic element is in contact with a second-side position of the cover body. In such a way, through arrangement of the cover body, the optimal electromagnetic wave shielding effect of the shielding structure can be brought into full play, and through configuration of the heat transfer element, a rapid heat dissipation effect can also be realized.

Description

technical field [0001] The invention relates to a structure for preventing electromagnetic interference, in particular to a shielding structure for preventing electromagnetic interference of electronic components with heat dissipation function. Background technique [0002] General electronic equipment such as mobile phones, tablet computers or other electronic devices are equipped with many electronic components. When the electronic equipment operates or operates, these electronic components will generate a certain degree of electromagnetic field. The electromagnetic field generated by these electronic components There will be mutual interference and blocking between them, which will affect the normal operation of electronic equipment, and electromagnetic waves will radiate outwards and cause harm to the human body. This phenomenon is called EMI (Electro Magnetic Interference; electromagnetic wave interference). [0003] At present, the general ways to prevent EMI include w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H05K7/20
Inventor 巫俊铭
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD