A grinding device for bga solder ball surface
A solder ball and grinding technology, which is applied in the direction of grinding drive device, grinding machine, grinding workpiece support, etc., can solve the problems that the surface roughness of solder ball can not be effectively improved, and the effect is not ideal, so as to achieve simple structure and improve surface roughness degree, easy to use effect
Active Publication Date: 2018-11-27
泰兴市智谷科技孵化器中心
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- Application Information
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Problems solved by technology
[0003] The existing technology usually puts solder balls into a rotating drum for surface finish work. This method of finish work cannot effectively improve the surface roughness of solder balls, and the effect is not ideal. It is necessary to improve
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Embodiment Construction
[0024] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0025] see figure 1 , figure 2 , a device for grinding the surface of a BGA solder ball according to the present invention includes a frame 1, the frame includes a base 11 and a beam 12 above the base, the base 11 is arranged in the middle of the beam 12 Below, a pair of parallel linear guide rails 2 are formed on the upper end surface of the base 11. A carrier plate 3 is arranged on the linear guide rails, and a first polishing mechanism 4 is arranged on the carrier plate. The first polishing mechanism There is a second polishing mechanism 5 on it;
[0026] see figure 2 , image 3 , the first polishing mechanism 4 includes a plurality of hemispherical first polishi...
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The invention discloses a BGA (ball grid array) solder ball surface smoothing device, comprising a frame. The frame comprises a base and a cross beam located above the base, a pair of parallel linear guide rails are formed on the upper end surface of the base, a carrier plate is disposed on the linear guide rails, a first polishing mechanism is disposed on the carrier plate, and a second polishing mechanism is disposed on the first polishing mechanism; the first polishing mechanism comprises a plurality of semispherical first polishing members, a rotary shaft fixedly connected to the bottom ends of the first polishing members, a gear sleeving the rotary shaft and a drive motor driving the gear to rotate; the second polishing mechanism comprises a plurality of semispherical second polishing members, a connecting shaft fixedly connected to the top ends of the second polishing members, a connecting plate connected to the upper end of the connecting shaft, and a drive cylinder, and a piston rod of the drive cylinder is fixedly connected to the middle of the upper end surface of the connecting plate. The invention can effectively solve the surface quality problems such as solder ball surface mist and wrinkle and effectively improve surface coarseness of a solder ball, and the device is simple in structure and convenient to use.
Description
Technical field: [0001] The invention relates to the technical field of BGA solder ball processing equipment, in particular to a device for smoothing the surface of BGA solder balls. Background technique: [0002] BGA solder balls are an important part of BGA soldering. Automatic BGA solder ball feeding mainly includes cutting and remelting molding methods and spray molding methods. The former is to cut solder wires of different diameters into units of consistent quality, and then process them in glycerin. Melting into balls; the latter is to melt the solder in a specific container (crucible), then inflate the crucible, increase the pressure to make the melted solder eject from a specific small hole at the bottom of the crucible, and then use high-frequency oscillation Make it into a ball. Regardless of whether the solder balls formed by the cutting and remelting molding method or the spray molding method have surface quality problems such as uneven surface and wrinkles. T...
Claims
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IPC IPC(8): B24B27/00B24B47/12B24B41/06
CPCB24B27/0076B24B27/0092B24B41/06B24B47/12
Inventor 叶伟然
Owner 泰兴市智谷科技孵化器中心