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3D printing processing technology of LTCC substrate cavity filling mold

A 3D printing and processing technology, applied in the field of 3D printing, can solve the problems of high-performance cavity LTCC substrates, insufficient dimensional accuracy, poor consistency, etc., and achieve the effect of improving printing efficiency, high dimensional accuracy, and good consistency

Inactive Publication Date: 2016-05-25
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are various preparation methods for traditional LTCC substrate cavity-filling molds, but they all have problems such as low yield, insufficient dimensional accuracy, poor consistency and poor durability, which have brought great troubles to the manufacture of high-performance LTCC substrates with cavities

Method used

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  • 3D printing processing technology of LTCC substrate cavity filling mold

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Embodiment Construction

[0031] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0032] Such as figure 1 As shown, a schematic diagram of the 3D printing process flow of a LTCC substrate cavity filling mold, including the following steps:

[0033] Step 1: Draw the three-dimensional graphics of the LTCC substrate cavity filling mold;

[0034] Step 2: importing the 3D graphics of the LTCC substrate cavity filling mold into a 3D printer;

[0035] Step 3: The 3D printer converts the three-dimensional graphics of the LTCC substrate cavity filling mold into a recognizable format, and performs 3D printing of the LTCC substrate cavity filling mold until the printing is completed.

[0036] In this embodiment, we assume that the LTCC substrate is formed by stacking n LTCC substrate green ceramic sheets,...

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Abstract

The invention relates to a 3D printing processing technology of an LTCC substrate cavity filling mold. The technology comprises the steps that a three-dimensional graph of the LTCC substrate cavity filling mold is drawn; the three-dimensional graph of the LTCC substrate cavity filling mold is imported into a 3D printing machine; the three-dimensional graph of the LTCC substrate cavity filling mold is converted into a recognizable format through the 3D printing machine, and 3D printing of the LTCC substrate cavity filling mold is carried out till printing is finished. According to the 3D printing processing technology of the LTCC substrate cavity filling mold, the problems that a traditional preparation method of a cavity filling mold is low in yield, not high enough in size precision and poor in consistency and durability are solved, the formed LTCC substrate cavity filling mold which is good in consistency, smooth and tight in surface, uniform in internal structure and high in size precision can be manufactured, and the 3D printing processing technology is applicable to high-performance LTCC substrate with a cavity.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a 3D printing processing technology of a LTCC substrate cavity filling mold. Background technique [0002] LTCC substrates (low temperature co-fired ceramic substrates) are used in multilayer circuit designs that can realize three-dimensional wiring in space in miniaturized devices. With the development of multi-chip module technology and the increasing use of surface-mount chips in miniaturized devices, more diverse requirements are put forward for LTCC substrates, which makes LTCC substrates with cavities more popular in the field of high-density electronic packaging. Wide range of applications. The quality of the cavity in the LTCC substrate has an important impact on the performance of the assembled chip, and a good cavity quality is the guarantee that the chip is working. The manufacturing process of the LTCC substrate is generally divided into several steps such as gr...

Claims

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Application Information

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IPC IPC(8): B29C67/00B33Y10/00
CPCB33Y10/00
Inventor 孟令宝方哲周卫
Owner BEIJING INST OF RADIO MEASUREMENT
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