Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate placement unit

A substrate and tray technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of rising tray manufacturing costs, widening intervals, increasing tray deformation, etc., to minimize temperature deviation, Effect of preventing temperature deviation and improving tray life

Active Publication Date: 2018-06-08
GIGALANE CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, when the upper surface of the chuck is formed with a convex curved surface, there is a problem that the degree of deformation of the tray is further increased, and the substrate cannot be stably placed on the upper part of the tray, thereby inducing defective products.
[0015] However, in order to solve the problem of widening the distance between the tray and the chuck due to the influence of the thickness, strength and width of the tray, it is necessary to form additional components such as adhesive sheets and embossing, which has the problem of increasing the manufacturing cost of the tray. , the heat transfer gas cannot be supplied to the tray smoothly, and the problem of inducing quality defects of the produced products cannot be solved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate placement unit
  • Substrate placement unit
  • Substrate placement unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in this description, the same symbols refer to substantially the same elements, under this rule, the content recorded in other drawings can be cited for description, and it can be omitted. Obvious or repetitive content.

[0054] The substrate placement unit in one embodiment of the present invention includes: a chuck 100, which is arranged inside the cavity of the substrate processing device; a tray 200, which is placed on the upper part of the chuck 100, and a plurality of substrates W are placed on its plane; and clamps 300, which makes the tray 200 and the chuck 100 combined and fixed.

[0055] It is characterized in that when clamps 300 are used to press and fix the edges of the chuck 100 and the tray 200, the center of the tray 200 is deformed to be conve...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a substrate seating unit which maintains a constant distance between a tray and a chuck fixated by a clamp. According to an embodiment of the present invention, the substrate seating unit includes: the chuck installed inside a chamber of a substrate processing device; the tray having a plurality of substrate seating grooves, wherein the substrates are inserted on the surface and installed on a chuck surface; and the clamp pressurizing the edge of the chuck and the tray to fixate the edge of the chuck and the tray. A spacer is protruded from the center of a bottom surface of the tray or the center of the chuck surface.

Description

technical field [0001] The present invention relates to a substrate mounting unit installed in a substrate processing apparatus, and more specifically, to a substrate mounting unit capable of maintaining a constant distance between a chuck and a tray fixed by clamps. Background technique [0002] In general, etching and vapor deposition using plasma are used in substrates used in semiconductors and thin film processing processes that require precision to improve the precision of manufactured products. [0003] As mentioned above, the plasma processing apparatus for generating plasma is composed of a cavity forming a shape, an antenna installed on the upper outside of the cavity, and a chuck for placing a substrate inside the cavity. Plasma is formed to process the substrate placed on the chuck. [0004] However, such a plasma processing apparatus places one substrate on a chuck for processing, so when processing a plurality of substrates, it takes a long time to work, and t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
CPCH01L21/68721H01L21/68771H01L21/68785H01L2221/6835H01L21/673H01L21/68735
Inventor 郑相坤金亨源丘璜燮金铉济郑熙锡
Owner GIGALANE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com