Cold-resistant multi-layer balun
A multi-layer balun and cold-resistant technology, applied in the microwave field, can solve the problems of large balun size and unfavorable integration of circuit components, and achieve the effect of reducing volume and facilitating integration
Inactive Publication Date: 2016-05-25
QINGDAO BOLAIMOSI NEW MATERIAL TECH CO LTD
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Problems solved by technology
[0004] The invention proposes a cold-resistant multi-layer balun, which solves the problem that the balun in the prior art is too large, which is not conducive to the integration of other circuit components
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[0012] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0013] figure 1 It is a three-dimensional structural schematic diagram of an embodiment of a cold-resistant multi-layer balun of the present invention. Such as figure 1 As shown, the cold-resistant multilayer balun 1 includes a top metal ground 21 , a bottom metal ground 22 and a metal shielding layer 3 . A window 32 is opened on the metal shielding layer 3 , and a wire is passed through the window 32 to connect to the via hole 31 . The cold-resist...
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The invention provides a cold-resistant multi-layer balun, which comprises a top metal ground, a bottom metal ground, a metal shielding layer, an upper coupling line, a wire connecting through hole and a lower coupling line, wherein a window is formed in the metal shielding layer; the upper coupling line is located between the top metal ground and the metal shielding layer; one end of the upper coupling line is connected to the top metal ground through an upper ground through hole; one end of the wire connecting through hole is connected to the other end of the upper coupling line; the wire connecting through hole passes through the window; the lower coupling line is located between the bottom metal ground and the metal shielding layer; one end of the lower coupling line is connected to the bottom metal ground through a lower ground through hole; and the other end of the lower coupling line is connected to the other end of the wire connecting through hole. By the cold-resistant multi-layer balun provided by the invention, the volume of the balun can be effectively reduced; and integration of the balun and other circuit elements is facilitated.
Description
technical field [0001] The invention relates to the microwave field, in particular to a cold-resistant multi-layer balun. Background technique [0002] In the field of radio frequency, baluns are widely used, and can be used in any place where balanced to unbalanced conversion is required, such as phase detectors, single sideband modulators, balanced mixers, and antennas. The balun of the microstrip line structure, especially the Marchand balun, has been widely used because of its simple model analysis and easy coupling with the coaxial line. [0003] The Marchand balun consists of two identical coupled lines, each one quarter wavelength long at the center frequency. Since the coupled line length of the Marchand balun is in the same order of magnitude as the central wavelength, its length is very long. If the Marchand balun is made on a plane, its volume will be larger. Contents of the invention [0004] The invention proposes a cold-resistant multilayer balun, which so...
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IPC IPC(8): H01P5/10
CPCH01P5/10
Inventor 李姗姗
Owner QINGDAO BOLAIMOSI NEW MATERIAL TECH CO LTD