A high-frequency signal line wiring structure and pcb board
A high-frequency signal and wiring structure technology, applied in the field of high-frequency signals, can solve the problems of high-frequency signal line length matching differences, insufficient PCB space, etc., to achieve the effect of solving insufficient PCB space, accurate length matching, and ensuring synchronization
Active Publication Date: 2018-06-29
BOE TECH GRP CO LTD
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Problems solved by technology
[0008] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a high-frequency signal line wiring structure and a PCB board to solve the problems of insufficient PCB space and matching differences in the length of high-frequency signal lines
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[0031] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] The following combination Figure 1a , 1b , figure 2 and image 3 , to describe the technical solution of the present invention in detail.
[0033] combine Figure 1a , Figure 1b and figure 2 As shown, the present invention provides a high-frequency signal line wiring structure, including: a pad 1, a high-frequency signal line 2 and a copper foil 3, and the high-frequency signal line 2 is welded on the pad 1, and the pad 1 is used as a starting point qualify. The end of the...
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The invention provides a high-frequency signal line wiring structure and a PCB board. A test portion is formed by extending the connection end of the high-frequency signal line and the pad from the pad area, the pad and the test portion are covered with copper foil, and the test portion is covered by copper foil. A test window is opened at the position of the test part on the copper foil, so that the high-frequency signal line is exposed, so that the high-frequency signal can be directly tested at the test window. In this way, the existing circular test point can be removed and the problem of insufficient PCB space can be effectively solved , to facilitate the wiring of other components; correspondingly, the connection line between the high-frequency signal line and the circular test point is removed, so that the length matching of each pair of high-frequency signal lines is more accurate, thereby ensuring the synchronization of high-frequency signal line transmission .
Description
technical field [0001] The invention relates to the technical field of semiconductor equipment manufacturing, in particular to a high-frequency signal [0002] Line wiring structure and PCB board. Background technique [0003] In the technical field of PCB (Printed Circuit Board, printed circuit board), the existing high-frequency signal line wiring structure not only includes high-frequency signal lines, pads and other structures, but also includes circular test points, circular test points and high-frequency signal lines. It is used to test the high-frequency signal transmitted by the high-frequency signal line. [0004] The existing high-frequency signal line wiring structure has the following defects: [0005] 1. Because each pair of high-frequency signal lines is connected to a circular test point, and the circular test point occupies a large area on the PCB, and other lines cannot be arranged in the area where the circular test point is located, resulting in crowded ...
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IPC IPC(8): H05K1/02
CPCH05K1/0268H05K2201/09427H05K1/025H05K1/0237
Inventor 吴月杨飞何敏王雨
Owner BOE TECH GRP CO LTD