Manufacture method adopting inner layer pattern transfer exposure

Abstract

The invention discloses a manufacture method adopting inner layer pattern transfer exposure. According to the technical schemes of the invention, the method includes the following steps that: a butterfly-shaped pad is arranged at least three corners of the periphery of each of an upper film and a lower film; the bottom of an auxiliary edge bar is bonded to the periphery of the lower film through a double-sided adhesive tape, and a double-sided adhesive tape is bonded to the top of the auxiliary edge bar; the upper film and the lower film are aligned with each other until corresponding butterfly-shaped pads on the two films form a circular structure; and the upper film is bonded on the top of the auxiliary edge bar; and a circuit board to be exposed is arranged in a space between the two films so as to be exposed. The method is simple and convenient in operation. With the method adopted, the manufacture of a film sandwich can be quickly completed. When the method is used to perform exposure, board scrapping caused by inter-layer misalignment can be avoided, and quality can be improved significantly.

Description

【Technical field】 [0001] The invention relates to a method for making inner layer pattern transfer exposure. 【Background technique】 [0002] In the PCB industry, during the transfer of the inner layer graphics of the multilayer board, the circuit graphics are exposed on both sides of the substrate with film negatives, and then the circuit is etched by negative etching, but since there is no reference point on both sides of the substrate Therefore, if the operation is not done properly, it is very easy to cause misalignment between the graphics layers on both sides, which will lead to the scrapping of the entire board. [0003] The present invention is made based on this situation. 【Content of invention】 [0004] The object of the present invention is to overcome the deficiencies of the prior art, and provide a method for making inner layer pattern transfer exposure, so as to achieve the purpose of improving product yield and reducing scrap. [0005] The present invention...

AI Technical Summary

Problems solved by technology

[0002] In the PCB industry, during the transfer of the inner layer graphics of the multilayer board, the circuit graphics are exposed on both sides of the substrate with film negatives, and then the circuit is etched by negative etching, but since there is no reference point on both sides of the substrate Therefore, if the operation is not done properly, it is very easy to cause misalignment between the graphics layers on both sides, which will lead to the scrapping of the entire board

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