Temperature and pressure sensor module and preparation method thereof
A sensor module and pressure sensor technology, applied in the field of sensors, can solve problems such as poor reliability, large structure, and single function
Active Publication Date: 2018-05-15
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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Problems solved by technology
[0003] At present, although the temperature and pressure sensor module has excellent sensing performance, there are still relatively large defects, such as large structure and single function; or poor reliability.
Method used
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Embodiment Construction
[0033] Specific embodiments of the present invention will be described in detail below. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0034] The invention provides a method for preparing a temperature and pressure sensor module, comprising:
[0035] 1) bonding the thermistor 5 to the inner core 3, and attaching the pin 7 of the thermistor 5 to one end of the gold-plated lead 6 of the inner core 3, and then curing;
[0036] 2) bonding the pressure sensor chip 4 to the inner core 3, and connecting the pressure sensor chip 4 to one end of the gold-plated lead 6 through a gold wire 8, and then performing curing treatment to obtain the inner core structure;
[0037] 3) placing the inner core structure in the inner cavity at one end of the inner core 3, and pouring the silica gel 10 into the inner cavity, and then performing curing treatment; ...
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The invention discloses a temperature and pressure sensor module and a preparation method thereof. The method comprises: 1) sticking a thermistor on an inner core, and attaching the lead of the thermistor to one end of a gold-plated lead wire of the inner core , curing treatment; 2) stick the pressure sensor chip on the inner core, and connect the pressure sensor chip to one end of the gold-plated lead through a gold wire, and perform curing treatment to obtain the inner core structural part; 3) the inner core structural part Place it in the inner cavity at one end of the inner core, and pour the silica gel into the inner cavity and cure it; 4) Weld the upper cover to the top of the inner core structural member to seal the thermistor and the pressure sensor chip; 5) Put the lead wire One end is welded to the other end of the gold-plated lead wire, and the other end of the wire is passed through the through hole of the bottom cylinder, and the bottom cylinder is welded to the upper cover to seal the end of the inner core structural member; 6) Pass the epoxy glue through the through hole Glue is poured into the inner cavity and cured. The temperature and pressure sensor module has the advantages of compact structure, diversified functions and high reliability.
Description
technical field [0001] The invention relates to the technical field of sensors, in particular to a temperature and pressure sensor module and a preparation method thereof. Background technique [0002] In recent years, the rapid development of industries such as the Internet of Things, smart phones, and automotive electronics has accelerated the demand for sensor products. The development of sensor products also puts forward higher requirements in terms of technical and economic indicators such as low power consumption, reliability, stability, low cost, miniaturization, miniaturization, and composite type. [0003] At present, although the temperature and pressure sensor module has excellent sensing performance, it still has relatively large defects, such as large structure and single function; or poor reliability. Contents of the invention [0004] The object of the present invention is to provide a temperature and pressure sensor module and its preparation method, the t...
Claims
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IPC IPC(8): G01D21/02
CPCG01D21/02
Inventor 洪火锋周宗明白卫星赵影李明何宏玉
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE