Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and priority system for inventory management in semiconductor manufacturing

A semiconductor and inventory technology, applied in semiconductor/solid-state device manufacturing, general control system, control/regulation system, etc.

Inactive Publication Date: 2016-06-01
WAFERTECH
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More specifically, it is undesirable to have inventory build up at a particular location or manufacturing tool while other manufacturing tools sit idle

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and priority system for inventory management in semiconductor manufacturing
  • Method and priority system for inventory management in semiconductor manufacturing
  • Method and priority system for inventory management in semiconductor manufacturing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] An inventory management system is provided for use in a production environment, such as a semiconductor fab, commonly referred to as a "fab." In semiconductor manufacturing, integrated circuits and other semiconductor devices are formed on substrates, such as silicon substrates, other suitable semiconductors or substrates, or referred to as "die". These bases are usually grouped into lots. The term "lot" (or batch) is what is generally known as a group of substrates that are processed together through a processing facility. Each batch therefore contains several substrates that are processed together as a group. Through a series of processes, each batch of substrates is processed through a large number of handling operations, testing operations, and measuring operations, thereby manufacturing semiconductor devices. By "processing" a batch of substrates, performing an operation on each substrate within the batch, and depending on the equipment or tool that performs the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An inventory tracking system and method for use in semiconductor manufacturing provide for generating a priority score that determines the order in which lots of substrates should be run. The priority score is generated using an algorithm that takes into account external lot priority considerations, inventory factors in the manufacturing facility, and processing tool capability factors. The processing tool capability factors include factors related to tool status and tool restrictions and the inventory factors include factors related to line balance, WIP (work-in-progress) forecasts and various downstream considerations. The priority score is generated dynamically and displayed at each processing operation for each lot that is queued for processing at the indicated operation. Various algorithms are used and different weights are assigned to many factors in calculating numerical values for several factors that combine to produce the priority score. The generated priority score can be tool-specific or module-specific.

Description

Background technique [0001] In today's semiconductor manufacturing industry, it is important to manufacture semiconductor equipment as quickly and efficiently as possible in order to meet business demands and customer deadlines, as is the most efficient use of resources in the production area. To gain a competitive advantage, semiconductor manufacturers are constantly looking for opportunities to shorten cycle times, lower costs, reduce variation, and increase production efficiency to ensure on-time delivery of customer orders. Therefore, it is not desirable for a production lot, ie a group of substrates to be processed together as a group, to sit around waiting to be processed, etc. It is also important to utilize multiple production and metering tools so that they can be used efficiently to their maximum capacity. When production tools are idle or when many substrates are idle, cycle times increase, costs increase, and productivity decreases. Manufacturing facilities run i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06Q10/08G06Q50/04
CPCG05B19/41865G05B2219/45031Y02P90/80Y02P90/02G05B19/00H01L21/67276
Inventor 马塞思·西迪基菲利普·余玛丽亚·冈作奥夫罗伯特·胡德安迪·布罗根菲利普·亨特
Owner WAFERTECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products