Method and system for monitoring leak rate of HDP chamber

Abstract

The invention provides a method and a system for monitoring leak rate of an HDP chamber. The method comprises the following steps: optimizing purging (purge) and pumping (pump) process after a cleaning (clean) process; comparing long-term chamber pumping with long-term chamber sealing after purging; sensing the change between pressure in the HDP chamber after a vacuum limit is reached and the pressure in the HDP chamber after second preset time is reached; and calculating the leak rate of the chamber. An existing single manual leak rate monitoring mode is broken; automatic leak rate monitoring is achieved; the problem is timely found; and the product risk is lowered.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method and system for monitoring the leakage rate of an HDP chamber. Background technique [0002] In the semiconductor integrated circuit manufacturing process, the high-density plasma process (HDP, High Dense Plasma process) is widely used in STI (Shallow Trench Insulation) and PMD (Pre-Metal Dielectric) dielectric layer filling due to its good hole filling ability. [0003] The reaction pressure of the HDP process is only 2 to 10 utorr, and the chamber needs to be very airtight. If there is a microleakage, it will directly cause pressure changes, affect particles, sputtering rate and other parameters, and have a significant impact on product defects and hole filling capabilities. In actual production operations, O-ring damage, Topnozzle cracks, etc. will cause micro-leakage in the chamber. These parts are checked during PM, or when the chamber is idle, use the mach...

AI Technical Summary

Problems solved by technology

[0003] The reaction pressure of the HDP process is only 2-10utorr, and the chamber needs to be very airtight. If there is a microleakage, it will directly cause pressure changes, affect particles, sputtering rate and other parameters, and have a significant impact on product defects and hole filling capabilities.

In actual production operations, O-ring damage, Topnozzle cracks, etc. will cause micro-leakage in the chamber. These parts are checked during PM, or when the chamber is idle, use the machine's own program to manually check the leak rate ( Leakrate) inspection, generally before and after PM or daily, is relatively time-consuming and cannot be monitored in real time, and the product risk is relatively high. However, if it is damaged during the process operation, the current leak rate inspection requires manual operation, and the problem cannot be found effectively and timely. , the product is more risky

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