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Packaging method and device

A packaging method and a packaging device technology, which are applied to lamination devices, chemical instruments and methods, electronic equipment, etc., and can solve problems such as uneven adhesive, poor packaging, and poor Newton rings in the packaging area

Active Publication Date: 2016-06-08
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the technical problems of the printing technology itself, the adhesive is not smooth on the contact surface with the display substrate, such as figure 1 As shown, it leads to poor packaging, and in the subsequent display process of the display panel, it is easy to have poor display such as Newton rings in the packaging area

Method used

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  • Packaging method and device

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Embodiment Construction

[0033] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0034] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0035] Such as figure 2 As shown, the packaging method according to one embodiment of the present invention includes:

[0036] S1, forming an adhesive 2 on the packaging area of ​​the display subs...

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PUM

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Abstract

The invention relates to a packaging method and device. The method includes the steps that a binding agent is formed in a packaging region of a display substrate; an organic film is formed on the binding agent; pressure is exerted on the organic film and the binding agent, wherein the organic film does not adhere to equipment for exerting force; the organic film is removed; a cover plate is pressed on the binding agent. According to the technical scheme of the embodiment, the organic film can be formed on the binding agent after the binding agent is formed, then pressure is exerted on the binding agent through the organic film, the contact face between the binding agent and the display substrate is flat, a good packaging effect is ensured, and it is avoided that newton rings or other poor display problems occur in the packaging region in the follow-up display process.

Description

technical field [0001] The present invention relates to the field of display technology, in particular, to a packaging method and a packaging device. Background technique [0002] In the existing packaging process, an adhesive (such as glass glue) is generally used to bond the cover plate to the display substrate, wherein the adhesive is generally formed on the packaging area of ​​the display substrate by printing (such as screen printing). The cover is then placed over the adhesive to complete the package. [0003] Due to the technical problems of the printing technology itself, the adhesive is not smooth on the contact surface with the display substrate, such as figure 1 As shown, poor encapsulation is caused, and in the subsequent display process of the display panel, display defects such as Newton rings are likely to appear in the encapsulation area. Contents of the invention [0004] The technical problem to be solved by the present invention is how to improve the f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/56
CPCH01L21/56H01L21/67H10K59/8722B32B37/02B32B37/26H01L21/568H10K50/8426H10K59/00H10K71/00B32B37/10B32B37/12B32B38/0036B32B2307/20B32B2307/40B32B2309/12B32B2457/20
Inventor 崔富毅陈旭孙泉钦高志强陈静静
Owner BOE TECH GRP CO LTD
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