Integrated liquid-cooling heat dissipation case

Abstract

The invention relates to the field of liquid cooling, and provides an integrated liquid-cooling heat dissipation case. The integrated liquid-cooling heat dissipation case comprises a case body, a circuit board and a liquid-cooling heat dissipation system. A closed space composed of a plurality of wall boards is formed in the case body. The circuit board is arranged in the case body, and one or more heat emission devices are arranged on the circuit board. A liquid storage groove is formed in the bottom of the case body and used for storing cooling liquid. The liquid-cooling heat dissipation system comprises a pipeline, a heat dissipation mechanism, a pumping mechanism and a spraying mechanism. The pumping mechanism is used for pumping the cooling liquid in the liquid storage groove into the pipeline, the spraying mechanism is connected to one end of the pipeline and used for spraying the cooling liquid into the case body or directly spraying the cooling liquid to the heat emission devices, and the heat dissipation mechanism is arranged at the position, in front of the spraying mechanism, of the pipeline and used for transferring heat of the cooling liquid to the outside of the case body. By the adoption of the integrated structural design, the integrated liquid-cooling heat dissipation case can be used in hostile environments and is convenient to carry, reasonable in design, light in weight, high in heat exchange capability and low in cost.

Description

technical field [0001] The invention relates to the field of liquid cooling, in particular to an integral liquid cooling and heat dissipation cabinet. Background technique [0002] With the rapid development of modern electronic power technology, the integration of electronic power is getting higher and higher, and the performance is getting better and better. At the same time, it is more and more difficult to dissipate heat. In order to facilitate the management and safe operation of equipment, many electronic and electrical devices are installed in special chassis. In order to ensure the normal operation of the equipment, the heat needs to be exported from the heating element to the environment. For devices with low heat generation, air cooling is usually used for heat dissipation. In more and more cases, air cooling can no longer meet the heat dissipation requirements, and liquid cooling applications are increasing. Compared with air cooling, liquid cooling can directly...

AI Technical Summary

Problems solved by technology

These two solutions can only cool and deal with the heat emitted by heat-generating devices with regular heat-dissipating surfaces such as CPU and GPU, but are powerless to other heat-generating devices on the circuit board, such as memory, resistors and other components, so they often need to be combined with air cooling

In addition, since the cooling liquid is not in direct contact with the heat-generating device, there is contact thermal resistance and conduction thermal resistance in the middle, resulting in low heat transfer efficiency

Images