Artificial graphite and copper composite heat sink and preparation method thereof

Abstract

The invention discloses an artificial graphite and copper composite heat sink and a preparation method thereof.The preparation method comprises the steps that for the heat sink, a unit heat dissipation layer is formed by rolling an artificial graphite layer, a copper foil layer and an artificial graphite layer in a combined mode, the heat sink can adopt an individual unit heat dissipation layer or be formed by overlaying multiple unit heat dissipation layers, each layer of the heat sink comprises the copper foil layer and the artificial graphite layers evenly distributed on the upper surface and the lower surface of the copper foil layer, the artificial graphite layers are evenly distributed on the upper surface and the lower surface of the copper foil layer through a conductive adhesive in an attached mode respectively, and the multiple unit heat dissipation layers are overlapped through the conductive adhesive.In this way, the heat sink is good in heat conduction effect and has a high electromagnetic shielding function.

Description

technical field [0001] The invention relates to the field of heat dissipation and electromagnetic shielding of heating components in electronic products, in particular to an artificial graphite / copper composite heat sink and a preparation method thereof. Background technique [0002] In the prior art, with the increase in the demand for mobile phones, tablet computers, or notebook computers and TVs and the increase in the use of display screens, the demand for high brightness of display screens increases the use of light-emitting diodes. In order to improve the operation of various electronic products Speed, at present, the CPU in various electronic products will emit a lot of heat due to high-speed operation, which also increases the heat generation of the device. At the same time, the battery power consumption increases, and the battery capacity also increases, which makes the display device heat due to increased energy consumption What's more, if the heat generation canno...

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Problems solved by technology

[0002] In the prior art, with the increase in the demand for mobile phones, tablet computers, or notebook computers and TVs and the increase in the use of display screens, the demand for high brightness of display screens increases the use of light-emitting diodes. In order to improve the operation of various electronic products Speed, at present, the CPU in various electronic products will emit a lot of heat due to high-speed operation, which also increases the heat generation of the device. At the same time, the battery power consumption increases, and the battery capacity also increases, which makes the display device heat due to increased energy consumption More, if the heating cannot be effectively controlled, the high temperature will not only make the CPU run out of order or lose its function, but also shorten the service life of the heating equipment

At the same time, the functions of display devices are increasing, and the parts used are also diversified. The number is large and the volume is smaller. The available space of the display device is more insufficient, and the distance between the components is closer, which is prone to interference.

When the thickness and thermal conductivity of natural graphite are not high, and the artificial graphite is fracturable due to its low softness, it loses its inherent X and Y axis thermal conductivity.

[0003] At present, the artificial graphite thickness of heat dissipation materials on the market is dominated by 25 microns, 40 microns are mass-produced but the thermal conductivity is not good, and the mass production of 70 microns is not high. More heat needs to be solved, so we have to change the heat from heat generation The point of component "A" is transmitted to other points for emission, so that the body temperature of the heating component "A" is greatly reduced

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