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A kind of high glass transition temperature soft-rigid bonded board containing copper-free substrate layer and its deglue process

A technology of soft-rigid combination board and high vitrification, which is applied in the field of PCB chemical process, can solve problems such as thick holes, achieve the effect of improving abnormal quality, reducing production cost and improving quality

Active Publication Date: 2019-02-12
高德(江苏)电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to change the original production process and solve the problem of thick holes after electroplating for the rigid-flex board with a special stacked structure using High Tg materials, and to provide a rigid-flex board with a high glass transition temperature containing a dummy layer degumming process

Method used

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  • A kind of high glass transition temperature soft-rigid bonded board containing copper-free substrate layer and its deglue process
  • A kind of high glass transition temperature soft-rigid bonded board containing copper-free substrate layer and its deglue process
  • A kind of high glass transition temperature soft-rigid bonded board containing copper-free substrate layer and its deglue process

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Experimental program
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Effect test

Embodiment 1

[0034] Such as figure 1 As shown, a high glass transition temperature rigid-flex board containing a copper-free substrate layer, including a top copper foil 1, a Dummy copper-free substrate layer 2, a flexible copper foil substrate 3, a prepreg 4 and a bottom copper foil 5, It is sequentially arranged with Pin lam from top to bottom to form a soft-rigid combination board; a through hole 6 is opened in the middle of the soft-hard combination board.

[0035] The stacking structure of the product type applicable to the present invention, and the board suitable for the production process of the present invention must meet the following three conditions at the same time

[0036] (1) Use High Tg material;

[0037] (2) Contains Dummy copper-free substrate layer;

[0038] (3) Rigid-flex board.

[0039] The deglue process of the high glass transition temperature soft-hard bonded board containing the copper-free substrate layer, its process flow is: adopt horizontal line transmissio...

Embodiment 2

[0045] The deglue process of the high glass transition temperature rigid-flex board containing the copper-free substrate layer, the specific steps are, the following concentrations are all calculated according to the volume of the reaction tank:

[0046] (1) Drilling: Use horizontal line transmission, take the soft-hard combination board with high glass transition temperature containing copper-free substrate layer, and drill holes on the drilling machine, specifically: Pinning, drilling machine drilling, pin return and inspection ;

[0047] (2) Plated through hole: the process of plated through hole is carried out after the rigid-flex board is drilled, including deburring, desmearing and PTH copper plating;

[0048] a. The hair removal process: firstly, use a high-speed rotating brush wheel for grinding, and the brush wheel speed is 1200r / min; then use ultrasonic vibration, the ultrasonic frequency is 50Hz, and the current is 1.5A; use a high-pressure water gun to rinse the ed...

Embodiment 3

[0060] The deglue process of the high glass transition temperature rigid-flex board containing the copper-free substrate layer, the specific steps are, the following concentrations are all calculated according to the volume of the reaction tank:

[0061] (1) Drilling: Use horizontal line transmission, take the soft-hard combination board with high glass transition temperature containing copper-free substrate layer, and drill holes on the drilling machine, specifically: Pinning, drilling machine drilling, pin return and inspection ;

[0062] (2) Plated through hole: the process of plated through hole is carried out after the rigid-flex board is drilled, including deburring, desmearing and PTH copper plating;

[0063] a. Deburring process: first use high-speed rotating brush wheel for grinding, the brush wheel speed is 1800r / min; then use ultrasonic vibration, ultrasonic frequency is 50Hz, current 2.5A; use high-pressure water gun to rinse the edge of the hole, water gun pressur...

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Abstract

The invention relates to a high-glass temperature rigid-flex board containing a copper-free substrate layer and a glue removing process of the rigid-flex board and belongs to the PCB chemical process technical field. The rigid-flex board includes top-layer copper foil, the dummy copper-free substrate layer, a flexible copper foil base material, a prepreg and bottom-layer copper foil which are located sequentially from top to bottom. In glue removal, a glue removal process can be completed by hole drilling and through hole plating, wherein the through hole plating is completed by burring, swelling, glue residue removal and plating through hole electroless copper. According to the rigid-flex board of the invention, an original independent glue removal + PTH whole-line process is streamlined to primary PTH whole-line production, and therefore, the biting of glue removal for PP can be effectively reduced, hole coarsening after electroplating can be alleviated, glue removal cost can be saved, and production efficiency can be improved.

Description

technical field [0001] The invention relates to a high glass transition temperature soft-rigid bonded board containing a copper-free substrate layer and a degumming process thereof, which are applied to the electroplating process stage of a Printed circuit board (hereinafter referred to as PCB), and belong to the technical field of PCB chemical process. Background technique [0002] With the development of science and technology, the progress of society and the improvement of people's living standards, electronic products are gradually developing from consumer electronics to short, small, light, and thin. The soft-rigid board is soft, foldable, and bendable. It can move freely along the three directions of X, Y, and Z, and can be used for wiring in three-dimensional space, so that the narrow space of instruments and meters can be fully utilized to meet the development trend of miniature and light electronic products. In the field of electronic products, high-tech fields such...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/42H05K1/11
CPCH05K1/115H05K3/429H05K3/4691H05K2201/095
Inventor 吴海娜
Owner 高德(江苏)电子科技股份有限公司