cooling equipment
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Publication Date
- 2019-02-26
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Abstract
Description
technical field
[0001] Embodiments of the present invention relate to the field of heat dissipation, and more specifically, to a heat dissipation device. Background technique
[0002] In the future 5G technology, hardware devices will be highly integrated, coupled with many requirements such as product miniaturization, high heat flux density and uniform temperature of devices, the existing heat dissipation equipment will not be able to meet the heat dissipation needs of future products. For example, the existing straight-tooth radiators or die-cast straight-tooth radiators are bulky, heavy, difficult to disassemble, and have the disadvantages of uneven heat dissipation and low heat dissipation efficiency. The loop gravity heat pipe (Loop Thermosiphon, LTS) radiator adopts phase change heat dissipation technology, and the heat dissipation performance of the LTS radiator is improved compared with the die-cast radiator, but the volume and weight are still large, and it cannot b...