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A thin film circuit board production line

A thin-film circuit board and production line technology, applied in the directions of laminated printed circuit board, printed circuit, printed circuit manufacturing, etc., can solve the problems of reduced fitting accuracy, misalignment of thin-film circuit board lines, easy to produce offset, etc. Save the production cost of the enterprise, improve the accuracy of the fit and set, and ensure the effect of the fit accuracy

Active Publication Date: 2018-09-14
SHENZHEN VILITY AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the field of thin film circuit board production, it involves multi-process collaborative operations. At present, it is difficult for equipment to meet the requirements of automatic production. Its production is generally carried out independently in multiple processes.
There are many defects in this production process: 1. On the automatic lamination equipment, since it does not have the function of pre-positioning, it is easy to produce offset during the rolling lamination process, resulting in a greatly reduced lamination accuracy , increasing the defect rate of the product
2. In the process of hot rolling and laminating, the coil material tends to shrink after being heated and cooled. The shrinkage of the film material will cause the circuit inside the film circuit board to be misaligned, resulting in an increase in the defective rate of the product

Method used

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  • A thin film circuit board production line
  • A thin film circuit board production line
  • A thin film circuit board production line

Examples

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Embodiment Construction

[0027] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] Such as Figure 1 to Figure 2 As shown, a kind of thin film circuit board production line of the present invention comprises the pre-shrinking coil furnace 1 that pre-shrinks the coil, the pre-positioning and laminating device 2 that loads and pre-positions the coil, and the lamination The hot rolling device 3 for hot rolling the final coil material; the coil material pre-shrinking furnace 1, the pre-positioning laminating device 2 and the hot rolling device 3 are connected in sequence. The coil material passes through the coil material pre-shrinking furnace 1, the pre-positioning laminating device 2 and the hot rolling device 3 in sequence. The coil material that has passed through the coil material pre-shrinking furnace 1 in advance can ensure that the product after the hot rolling process shrinks, and the pre-positioning lamination The laminating device 2 ...

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Abstract

The invention relates to the technical field of automatic production equipment of thin film circuit boards, in particular to a high-precision thin film circuit board production line. The high-precision thin film circuit board production line comprises a coil preshrinking furnace, a pre-positioning lamination device and a hot roll-press device, wherein the coil preshrinking furnace is used for carrying out preshrinking on the coil; the pre-positioning lamination device is used for carrying out loading and pre-positioning lamination on the coil; the hot roll-press device is used for carrying out hot roll-press on the laminated coil; the coil preshrinking furnace, the pre-positioning lamination device and the hot roll-press device are sequentially connected with one another; the coil sequentially passes through coil preshrinking furnace, the pre-positioning lamination device and the hot roll-press device; the coil which passes through the coil preshrinking furnace in advance can ensure shrinkage of a product subjected to hot roll-press procedure; the pre-positioning lamination device accurately laminates a film sheet on the coil and achieves pre-positioning before lamination; the lamination and registration accuracy is improved when automatic lamination of the product is achieved; and the hot roll-press device carries out hot-press lamination on a multi-layer film material to form the high-precision thin film circuit board. The thin film circuit board can achieve automatic production, ensures the lamination accuracy, improves the yield and saves the production cost of an enterprise.

Description

technical field [0001] The invention relates to the technical field of thin film circuit board automatic production equipment, in particular to a thin film circuit board production line. Background technique [0002] In the field of thin film circuit board production, it involves multi-process collaborative operations. At present, it is difficult for equipment to meet the requirements of automatic production, and its production is generally carried out independently in multiple processes. There are many defects in this production process: 1. On the automatic lamination equipment, since it does not have the function of pre-positioning, it is easy to produce offset during the rolling lamination process, resulting in a greatly reduced lamination accuracy , Increase the defective rate of the product. 2. In the process of hot rolling and laminating, the coil material will often shrink after being heated and cooled. The shrinkage of the film material will cause the circuit inside...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0058H05K2203/068H05K2203/163
Inventor 章日华章春强李涛蔺绍红
Owner SHENZHEN VILITY AUTOMATION EQUIP
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