Electrolytic polishing device

A technology of electrolytic polishing and electrolytic bath, which is applied in the direction of electrolytic process and electrolytic components, etc. It can solve the problems of uneven polishing, excessive polishing, and low polishing efficiency of complex workpieces, so as to avoid excessive polishing or low polishing efficiency, improve appearance quality, fine-tuned effects

Pending Publication Date: 2016-06-29
SHANGHAI MICROPORT CARDIOFLOW MEDTECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide an electrolytic polishing device to solve the problems that the existing electrolytic polishing device polishes complex workpieces unevenly, affects the appearance quality of the workpiece, and the distance between cathode and anode is difficult to finely adjust, resulting in excessive polishing or low polishing efficiency.

Method used

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Embodiment Construction

[0033] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some implementations, not all implementations. Based on the implementation manners in the present invention, all other implementation manners obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0034] In describing the present invention, it is to be understood that the terms "central", "longitudinal", "transverse", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or pos...

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Abstract

The invention discloses an electrolytic polishing device, and relates to the technical field of electrolytic polishing of the surfaces of metal materials. The electrolytic polishing device comprises an electrolytic bath, a cathode and an anode. The cathode and the anode are arranged in an electrolyte in the electrolytic bath. A workpiece is arranged in the electrolyte. A plurality of rings of annular cathode frameworks, which are distributed parallely, are arranged at the end part of the cathode. The workpiece is placed inside the annular cathode frameworks. The electrolytic polishing device has the advantages that all parts of the workpiece can be uniformly polished, the appearance quality of the workpiece is improved, and besides, the fine adjustment of the distance between the cathode and the anode is realized by adjusting the number and the diameters of the annular cathode frameworks according to the shape of the workpiece, so that the distance between the cathode and the anode is appropriate, and the problem of excessive polishing or low polishing efficiency is solved effectively.

Description

technical field [0001] The invention relates to the technical field of electrolytic polishing of metal material surfaces, in particular to an electrolytic polishing device. Background technique [0002] Electrochemical polishing, also known as electrolytic polishing, refers to the process of passing a direct current through an electrolytic cell under a certain applied voltage to cause anodic dissolution of the metal workpiece in the electrolyte, thereby leveling the metal surface and making it shiny. [0003] Compared with conventional mechanical polishing, electrochemical polishing has the following characteristics: [0004] (1) Electrochemical polishing uses the polished body as an anode to cause electrochemical dissolution to smooth and gloss its surface; while mechanical polishing is obtained by cutting, plastic deformation, and abrasion to remove the convex portion of the polished surface Smooth surface, this difference will affect various properties of the metal surfa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25F3/16C25F7/00
CPCC25F3/16C25F7/00
Inventor 虞奇峰梁玉晨王海山陈靖宇秦涛
Owner SHANGHAI MICROPORT CARDIOFLOW MEDTECH CO LTD
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