Process for filling resin in blind groove of printed circuit board (PCB)

A PCB board and blind groove technology, applied in the field of PCB blind groove plug resin technology, can solve the problems of unsatisfactory groove plug, production troubles, unclean grinding board, etc., and achieve the effect of improving quality and improving appearance quality.

Active Publication Date: 2016-06-29

DONGGUAN MEADVILLE CIRCUITS

4 Cites 12 Cited by

AI-Extracted Technical Summary

Problems solved by technology

[0003] 1) Due to the large volume of the blind groove, there will be a problem of insufficient oil under the silk screen;

[0004] 2) After the silk screen is screen printed, there will be a problem of pulling oil in the slot, which will cause the slot to be unsatisfactory;

[0005] 3) Since the bottom of the blind groove cannot form gas flow during the resin plugging process, it is easy to generate resin bubbles at the bottom;

[0006] 4) Due to the demand f...

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Method used

(7), screen printing removes air bubbles, and test printing is carried out on the alignment film, and the screen printing device is provided with front scraper, rear scraper and driving device, and described driving device drives front scraper and rear scraper horizontally to and fro as power, and moves back and forth, For silk screen printing, double-knife screen printing mode is adopted, the screen printing speed of the front scraper is 10~40mm/Sec, and the back scraper: 10~40mm/Sec; the screen printing pressure of the front scraper is 0.3~0.5MPa, and the screen printing pressure of the back scraper is 0.3~0.5 MPa; the screen printing angle of the front scraper is 90±5°, and the screen printing angle of the rear scraper is 90±5°; the external environment of the screen printing is a vacuum of 100-200Pa, and the width of the scraper is 20-30mm, and the hardness is 75-80°. Plug hole scraper, in the whole silk screen printing process, the number of scraping printing is 5-8 times, through multiple scraping printing, squeeze the ink, effectively remove the air bubbles, and eliminate the air in the ink;

(7), screen printing removes air bubbles, test printing is carried out on the alignment film, the silk screen device is provided with a front scraper, a rear scraper and a driving device, and the driving device drives the front scraper and the rear scraper horizontally to and fro as power, For silk screen printing, double-knife screen printing mode is adopted, the screen printing speed of the front scraper is 10~40mm/Sec, and the back scraper: 10~40mm/Sec; the scree...

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Abstract

A processing for filling resin in a blind groove of a printed circuit board (PCB) is used for filling resin ink in the blind groove of the PCB. The process comprises the following steps of mesh installation, base plate installation, plate loading, pre-setting, ink addition, alignment film pasting on the PCB, silk-screening to remove air bubbles, blind groove filling, plate baking and resin grinding, wherein during the silk-screening process of the step (7), a double-cutter silk-screening mode is adopted, scrape screening is carried out for 5-8 times, and air in the ink is removed; in the step of (8), the blind groove is filled with the resin from one surface of the blind groove by a silk-screening mode, and during silk-screening process, the double-cutter silk-screening mode is adopted and scrape screening is carried out for one time. During the whole fabrication process, a silk-screening air bubble removal process is introduced, scrape screening is carried out for many times, and air bubbles in the ink are removed; the air bubbles are removed before blind hole filling, thus, the problem that filling is not enough caused by insufficient oil feeding quantity after the blind groove is filled with the resin is prevented; and moreover, the groove is fully filled with the resin ink after the blind groove is filled with the resin, no air bubble is generated in the resin ink at the bottom of the groove after the blind groove is filled with the resin, and the product quality is improved.

Application Domain

Printed circuit aspectsPrinted circuit manufacture

Technology Topic

Printed circuit boardEngineering +2

Image

Examples

Experimental program(1)

Example

[0026] Such as Figure 1 to Figure 3 As shown, the present invention provides a PCB blind slot plugging resin process, which is used to fill the blind slot 11 of the PCB board 10 with resin ink 30. The following is the first embodiment of the present invention. The entire blind slot 11 filling resin ink 30 process includes The following steps:

[0027] (1) Install the net, make the 0.15-0.20mm thick aluminum sheet into the net plate 20 and install it on the screen printing equipment. The net plate 20 is provided with a gong hollow blind groove area oil drop hole 21, and the blind groove area falls The aperture size of the oil hole 21 is larger than the slot position of the blind groove 11 and forms a difference with it, specifically, the difference is 10-16 mil;

[0028] (2) Install the backing board to provide a support platform for the PCB board 10;

[0029] (3) On the upper board, place the PCB board 10 on the backing board, and the opening part of the blind slot 11 of the PCB board 10 faces the net board 20;

[0030] (4) Pre-positioning, adjust the position of the PCB board 10 on the backing plate;

[0031] (5) Add ink, add 250-500g resin ink 30 to the screen printing equipment;

[0032] (6) Paste the alignment film, paste the alignment film on the PCB board 10, perform trial printing before silk printing, and adjust the position of the PCB board 10 according to the results of the trial printing, so that the blind groove area on the screen 20 falls The oil hole 21 is aligned with the blind groove 11 on the PCB board 10, and after the position adjustment is completed, a new alignment film is re-attached on the surface of the PCB board 10;

[0033] (7) Screen printing to remove air bubbles, and test printing on the alignment film. The screen printing device is equipped with a front scraper, a rear scraper and a driving device. The driving device acts as a power to drive the front scraper and the rear scraper to move back and forth horizontally. Using the dual-blade screen printing mode, the screen printing speed of the front squeegee is 10-40mm/Sec, and the rear squeegee: 10-40mm/Sec; the screen printing pressure of the front squeegee is 0.3-0.5MPa, and the screen printing pressure of the rear squeegee is 0.3-0.5MPa; The screen printing angle of the squeegee is 90±5°, and the screen printing angle of the rear squeegee is 90±5°; the external environment during the screen printing is a vacuum of 100-200Pa, and the squeegee is 20-30mm in width and 75-80° in hardness. , In the entire screen printing process, the number of squeegees is 5-8 times. Through multiple squeegees and squeezing the ink, the bubbles are effectively removed and the air in the resin ink is eliminated;

[0034] (8) Plug the blind groove 11, remove the alignment film from the PCB board 10, use silk screen to plug the blind groove 11 with resin from the side of the blind groove 11, and use the double-knife screen printing mode during the screen printing, and the screen printing speed of the front squeegee is 10~40mm/Sec, rear squeegee screen printing speed is 10~40mm/Sec; front squeegee screen printing pressure is 0.3~0.5MPa, rear squeegee screen printing pressure is 0.3~0.5MPa; front squeegee screen printing angle is 95±5°, rear squeegee The screen printing angle is 90±5°; the vacuum degree during the screen printing is 100~200Pa; the number of squeegees is 1 time; the squeegee is selected as a plug squeegee with a width of 20~30mm and a hardness of 75~80°;

[0035] (9) Baking board, put the PCB board after plugging holes into the oven, keep it at 110°C for 60-75 minutes, and then keep it at 150°C for 30-60 minutes.

[0036] (10) Resin grinding, using a grinder to polish the surface of the PCB board 10 to ensure that the resin exposed surface is smooth after plugging.

[0037] See Figure 4 to Figure 11 , Which is the second embodiment of the present invention. The implementation method of the second embodiment is basically similar to the implementation method of the first embodiment. The entire blind groove 11a filling resin ink 30 process also includes the following steps: installing a net, installing a pad, and The difference between the board, pre-positioning, adding ink, aligning film, screen printing to remove bubbles, plug blind groove 11, baking board, and resin grinding, the difference is that the PCB board 10a of this embodiment is also provided with VIPPO vias 12a. Before the process of filling the groove 11a with resin, perform the process of filling the resin with VIPPO via 12a, such as Figure 4 to Figure 6 As shown, the entire process of plugging the resin ink 30 into the VIPPO via 12a includes the following steps:

[0038] (1) Install the net, make the 0.15-0.20mm thick aluminum sheet into the net plate 40 and install it on the screen printing equipment. The net plate 40 is provided with the VIPPO oil drop hole 41 and the VIPPO oil drop hole 41. The aperture size is larger than the VIPPO via 12 of the PCB board 10 and forms a difference with it, specifically, the difference is 10-16 mil;

[0039] (2) Install the backing board to provide a support platform for the PCB board 10;

[0040] (3) On the upper board, place the PCB board 10 on the backing board, and the opening part of the blind slot 11 of the PCB board 10 faces the net board 20;

[0041] (4) Pre-adjust the position, adjust the position of the PCB board 10 on the backing board so that the VIPPO drop hole 42 on the screen 20 and the VIPPO via 12 on the PCB board 10 are aligned with each other;

[0042] (5) Add ink, add 250-1000g resin ink 30 to the screen printing equipment;

[0043] (6), plug hole, resin plug hole in the form of silk screen printing, single-jet screen printing mode is used for silk screen printing; screen printing speed is 10~80mm/Sec, screen printing pressure is 0.3~0.5MPa, screen printing angle is 90±5°, laminating The speed is 30~100mm/Sec; the vacuum degree during screen printing is 100-200Pa, the number of squeegees: 1-3 times; the squeegee is 20-30mm in width and 75-80° in hardness;

[0044] (7) Scrape, use a screen printing machine to remove excess resin ink 30. When operating, first fix the PCB board 10 with wrinkle tape. The screen printing machine adopts one-way printing function and one-way printing. After the printing is completed, use an oil knife to remove Remove the residual resin on the scraper, remove the board tape, and take out the PCB board 10;

[0045] (8) Baking board, put the PCB board after plugging holes into the oven, keep it at 110℃ for 60-75 minutes, then keep it at 150℃ for 30-60 minutes.

[0046] Such as Figure 7 to Figure 9 As shown, after the VIPPO via 12 is filled with resin ink 30, filling the entire blind groove 11 with resin includes the following steps:

[0047] (1) Install the net, make the 0.15-0.20mm thick aluminum sheet into the stencil 20 and install it on the screen printing equipment. The stencil 20 is provided with an oil hole 21a in the blind groove area, and the blind groove area is dropped. The aperture size of the oil hole 21a is larger than the slot position of the blind groove 11 and forms a difference with it, specifically, the difference is 10-16 mil;

[0048] (2) Install the backing board to provide a support platform for the PCB board 10;

[0049] (3) On the upper board, place the PCB board 10 on the backing board, and the opening part of the blind slot 11 of the PCB board 10 faces the net board 20;

[0050] (4) Pre-positioning, adjust the position of the PCB board 10 on the backing plate;

[0051] (5) Add ink, add 250-500g resin ink 30 to the screen printing equipment;

[0052] (6) Paste the alignment film, paste the alignment film on the PCB board 10, perform trial printing before silk printing, and adjust the position of the PCB board 10 according to the results of the trial printing, so that the blind groove area on the screen 20 falls The oil hole 21a is aligned with the blind groove 11 on the PCB board 10, and after the position adjustment is completed, a new alignment film is re-attached on the surface of the PCB board 10;

[0053] (7) Screen printing to remove air bubbles, and test printing on the alignment film. The screen printing device is equipped with a front scraper, a rear scraper and a driving device. The driving device acts as a power to drive the front scraper and the rear scraper to move back and forth horizontally. Using the dual-blade screen printing mode, the screen printing speed of the front squeegee is 10-40mm/Sec, and the rear squeegee: 10-40mm/Sec; the screen printing pressure of the front squeegee is 0.3-0.5MPa, and the screen printing pressure of the rear squeegee is 0.3-0.5MPa; The screen printing angle of the squeegee is 90±5°, and the screen printing angle of the rear squeegee is 90±5°; the external environment during the screen printing is a vacuum of 100-200Pa, and the squeegee is 20-30mm in width and 75-80° in hardness. , In the entire screen printing process, the number of squeegees is 5-8 times. Through multiple squeegees and squeezing the ink, the bubbles are effectively removed and the air in the ink is eliminated;

[0054] (8) Plug the blind groove 11, remove the alignment film from the PCB board 10, and plug the blind groove 11 with resin from the side of the blind groove 11 with silk screen. When screen printing, use the double-blade screen printing mode, and the front scraper screen printing speed: 10~40mm/Sec, rear squeegee screen printing speed is 10~40mm/Sec; front squeegee screen printing pressure is 0.3~0.5MPa, rear squeegee screen printing pressure is 0.3~0.5MPa; front squeegee screen printing angle is 95±5°, rear squeegee The screen printing angle is 90±5°; the vacuum degree during the screen printing is 100~200Pa; the number of squeegees is 1 time; the squeegee is selected as a plug squeegee with a width of 20~30mm and a hardness of 75~80°;

[0055] (9) Baking board, put the PCB board after plugging holes into the oven, keep it at 110°C for 60-75 minutes, and then keep it at 150°C for 30-60 minutes.

[0056] (10) Resin grinding, using a grinder to polish the surface of the PCB board 10 to ensure that the resin exposed surface is smooth after plugging.

[0057] The beneficial effects of the resin plugging process for the PCB blind groove 11a of the present invention are: the introduction of the silk-screening and de-bubbling process during the entire production process, multiple scraping, removing the bubbles in the ink, and performing the de-bubbling treatment before plugging the blind holes, so that After the blind groove 11a is filled with resin ink, there will be no plugging problems caused by insufficient oil; and the resin ink plug groove is full after the blind groove 11a is filled with resin, and the resin ink at the bottom of the blind groove 11a is filled with resin ink 30 without air bubbles, which improves the product In addition, the resin grinding process is introduced in the entire production process to solve the problem of no unclean or excessive grinding of the grinding plate after the blind groove 11 is filled with resin, and to improve the appearance quality of the product.

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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine

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