Vapor support structure

Abstract

Provided is a temperature- equalization plate support body structure including a first plate body, a second plate body, a support body, and a working fluid;a cavity is formed between the first plate body and the second plate body; the support member is arranged in the cavity; the support member is composed of at least one substrate and a plurality of support parts; a plurality of channels are arranged on the support member; and the working fluid fills in the cavity and circulates in the channels. The temperature-uniforming plate support body structure can solve the problems of thermal expansion deformation or pressure compression deformation of a temperature-uniforming plate and the difficult control of the bottom flatness, and has the advantages of saving manufacturing work time and improving the heat transfer efficiency.

Description

【Technical field】 [0001] The invention provides a vapor chamber, especially a vapor chamber support body structure that can improve the support degree and reduce the manufacturing cost. 【Background technique】 [0002] The current mobile devices, personal computers, servers, communication chassis or other systems or devices are all due to the improvement of computing performance, and the heat generated by their internal computing units is also increasing. Therefore, a cooling unit is relatively needed to assist in cooling. The vast majority of manufacturers use radiators, heat pipes, vapor chambers and other heat dissipation elements with fans for auxiliary heat dissipation, and when large-area heat dissipation is required, they use vapor chambers to absorb heat and cooperate with radiators and cooling fans for forced heat dissipation. Because the heat dissipation elements need to be closely fitted to prevent the occurrence of thermal resistance, the uniform temperature plate...

AI Technical Summary

Problems solved by technology

[0003] The vapor chamber is a surface-to-surface heat transfer, and in the above description, multiple support columns are provided to prevent the vapor chamber from being heated and expanded or crushed and deformed by external forces, but additional manufacturing hours and manufacturing costs are required in the manufacturing process (Support cylinder), and if a plurality of copper pillars are used to combine sintered rings, the copper pillars are used as a support, and the sintered ring is only used as a reflow cycle. It is difficult to control the flatness of the bottom, or use multi-groove copper pillars. The copper pillars also serve as supports and reflow cycles, and the flatness of the bottom is also difficult to control, or the support pillars and / or steam channels or flow channels are directly etched on the board, but the time required for etching is relatively short Increase, and the deeper the depth, the longer the processing time, and it needs to go through cleaning, drying and other processes to increase its manufacturing man-hours

[0004] Therefore, although the known technology solves the problems such as deformation, it increases the manufacturing man-hours and costs, and the bottom flatness is not easy to control. Therefore, it is still necessary to conduct in-depth discussions on how to reduce the manufacturing cost.

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