Temperature-uniformizing plate structure and manufacturing method for temperature-uniformizing plate

Abstract

The invention discloses a temperature-uniformizing plate structure and a manufacturing method for the temperature-uniformizing plate. The temperature-uniformizing plate structure comprises a body, wherein the body is provided with a plurality of flow guide bodies and working fluid; at least one flow channel is formed among the flow guide bodies, and the flow channel and the flow guide bodies define a flow guide area together; and the two ends of the flow guide area are respectively connected with a first convection area and a second convection area and are communicated with the flow channel. The temperature-uniformizing plate structure is characterized in that the body is formed by extruding according to the invention, and the internal flow channel is formed when the external body is formed, so that the labor hour is reduced greatly and the cost is saved.

Description

technical field [0001] A uniform temperature plate structure and a manufacturing method thereof, especially a uniform temperature plate structure and a manufacturing method thereof formed by aluminum extrusion to save materials and reduce costs. Background technique [0002] The more commonly used heat conduction elements are heat pipes, vapor chambers, flat heat pipes and other metal elements with good heat conduction performance. The heat pipe is mainly used for remote heat conduction. It absorbs heat at one end and converts the internal working fluid from liquid to Vapor evaporation transfers heat to the other end of the heat pipe, thereby achieving the purpose of heat conduction. [0003] Vapor chambers are selected as heat conduction elements for parts with a large heat transfer area. The vapor chamber mainly absorbs heat on the side surface that is in contact with the heat source, and then conducts heat to the other side for cooling and condensation. [0004] The trad...

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Problems solved by technology

[0005] However, most of the known vapor chamber structures are composed of an upper plate body and a lower plate body correspondingly covered. The aforementioned support and capillary structures are mainly made by sintering or milling or etching or mesh weaving. However, this manufacturing method is time-consuming and expensive

[0006] In addition, the known vapor chamber is made of copper, which has better heat conduction efficiency but relatively high cost; therefore, the known technology has the following disadvantages:

[0007] 1. High cost;

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