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Method for establishing tin soldering process libraries and system applied to same

A technique for establishing a method and a process library, applied in the method for establishing a solder process library and the system field of the solder process library, can solve problems such as low soldering efficiency, achieve the effects of improving soldering efficiency, overcoming limitations, and avoiding trial soldering

Inactive Publication Date: 2016-07-06
迈力(北京)机器人科技有限公司
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  • Claims
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Problems solved by technology

[0004] The embodiment of the present invention provides a method for establishing a soldering process library and a system applied to the soldering process library to solve the problem that these parameters need to be reset every time a new soldering circuit board is replaced, resulting in low soldering efficiency The problem

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  • Method for establishing tin soldering process libraries and system applied to same
  • Method for establishing tin soldering process libraries and system applied to same
  • Method for establishing tin soldering process libraries and system applied to same

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Embodiment Construction

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0028] The following will combine Figure 1 to Figure 4 The method for establishing the solder process library provided by the embodiment of the present invention and the system applied to the solder process library are described in detail.

[0029] see figure 1 , is a method for establishing a solder process library provided by an em...

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Abstract

An embodiment of the invention discloses a method for establishing tin soldering process libraries and a system applied to the same. The method includes acquiring solder joint types of first circuit boards, selecting tin soldering environmental parameters according to the solder joint types and determining tin soldering parameters according to the tin soldering environmental parameters and the solder joint types; counting and storing the solder joint types of the first circuit boards, the tin soldering environmental parameters and tin soldering parameters. The solder joint types include pin parameters and pad parameters of components on the first circuit boards, and the tin soldering environmental parameters correspond to the solder joint types. The tin soldering parameters correspond to the tin soldering environmental parameters and the solder joint types and include tin feeding speeds, tin feeding lengths, preheating time and tin-soldered stagnation time. The method and the system have the advantages that tin soldering can be carried out by the aid of the tin soldering parameters in the tin soldering process libraries when the tin soldering process libraries contain the solder joint types of the circuit boards to be subjected to tin soldering and the tin soldering environmental parameters, accordingly, the tin soldering parameters do not need to be manually set one by one, and the tin soldering efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of soldering process, in particular to a method for establishing a soldering process library and a system applied to the soldering process library. Background technique [0002] In the field of soldering technology, the automatic soldering robot is a device that replaces manual soldering of circuit boards. It automatically solders the soldered circuit boards according to the pre-set soldering program, instead of manual soldering. And it is faster and more precise than manual welding. [0003] Generally, since different circuit boards correspond to different soldering conditions, before the automatic soldering robot solders each time, it is necessary to manually set parameters according to the conditions of the circuit board to be soldered, including the type of soldering iron tip and soldering iron for soldering the circuit board. Set parameters such as temperature, tin feeding speed and preheating time, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25J9/16B25J11/00B23K3/00
CPCB23K3/00B25J9/1653B25J11/005
Inventor 尹斌杰王华锋刘志雄
Owner 迈力(北京)机器人科技有限公司
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