The utility model discloses a
soldering tin mechanism, relates to
soldering tin field, including operating floor and mounting sleeve, operating floor upper surface middle part is provided with the moving groove, operating floor upper surface is fixedly connected with the support, support one side top is fixedly connected with the
traverse subassembly, through the setting of cooling subassembly and turnover subassembly, the cooling subassembly is fixed with the mounting sleeve. During use, the two sides of a circuit board are placed in the C-shaped clamping plates, the
threaded rod is rotated to drive the lower pressing plate to fix the circuit board, then the first motor is started to drive the turnover frame to rotate, and then the circuit board is turned over to the reverse side, so that the time for fixing the reverse side of the circuit board again is shortened, and the
workload of workers is reduced; the air cooler is started, then
cold air is blown into the hose from the air outlet
pipe, then blown into the air blowing
pipe from the hose and finally blown to the
tin soldering position through the air blowing head, cooling of the tin soldering position is accelerated, and therefore the tin soldering efficiency of the circuit board is improved.