Circuit board and mobile terminal

Abstract

The invention discloses a circuit board which comprises a board body and a heat absorbing and storing member. The board body comprises two board surfaces. At least one board surface is provided with the heat absorbing and storing member. The heat absorbing and storing member comprises a heat absorbing and storing material with a heat absorbing function and a heat storage function. The heat absorbing and storing material is used for absorbing heat which is radiated from a heating component on the board body. The invention further discloses a mobile terminal. The heat which is radiated from the heating component on the circuit board can be directly absorbed through the heat absorbing and storing material which is arranged on the circuit board, thereby realizing direct heat radiation on a position with relatively high heating value, thereby improving heat dissipation performance and reliability of the mobile terminal.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a circuit board and a mobile terminal. Background technique [0002] With the development of the mobile phone industry, the configuration of mobile phones is getting higher and higher, and there are more and more electronic components on the mobile phone circuit board, which leads to a corresponding increase in the heat generated by the mobile phone. If the heat cannot be controlled or transferred, it will cause two Aspects of impact: 1. The temperature of the circuit board will be too high, affecting the performance of electronic components, and even slowing down the calculation of the mobile phone, affecting the user experience. 2. The heat emitted by the circuit board is transferred to the shell of the mobile phone, resulting in a high temperature of the shell, which will cause problems such as hot hands and ears when used. [0003] In order to solve the heating problem of...

AI Technical Summary

Problems solved by technology

[0002] With the development of the mobile phone industry, the configuration of mobile phones is getting higher and higher, and there are more and more electronic components on the mobile phone circuit board, which leads to a corresponding increase in the heat generated by the mobile phone. If the heat cannot be controlled or transferred, it will cause two problems. Aspects of impact: 1. The temperature of the circuit board will be too high, affecting the performance of electronic components, and even slowing down the calculation of the mobile phone, affecting the user experience

2. The heat emitted by the circuit board is transferred to the shell of the mobile phone, resulting in a high temperature of the shell, which will cause problems such as hot hands and ears when using

[0003] In order to solve the heating problem of the mobile phone, the heat-dissipating graphite sheet is generally arranged on the inner wall of the casing or the shielding cover of the mobile phone to indirectly dissipate heat from the chip. The location is limited, and it is impossible to directly dissipate heat at locations with high heat generation, resulting in poor heat dissipation performance

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