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A kind of manufacturing method of stepped groove pcb and pcb

A production method and stepped groove technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, printed circuit components, printed circuits, etc., can solve the problems of signal interference, poor reliability, low resistance to external force, etc., to achieve shielding Function, high reliability, reduce the effect of mutual interference

Active Publication Date: 2019-03-05
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it still has the following deficiencies after assembling electronic components: the magnetic field emission in the microwave radio frequency area is likely to cause interference to the inner layer or adjacent signals; the stepped groove has no metal layer support at all, and has low resistance to external forces and poor reliability.

Method used

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  • A kind of manufacturing method of stepped groove pcb and pcb
  • A kind of manufacturing method of stepped groove pcb and pcb
  • A kind of manufacturing method of stepped groove pcb and pcb

Examples

Experimental program
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Embodiment 1

[0040] Such as Figures 1 to 7 As shown, in this embodiment, a method for manufacturing a stepped groove PCB according to the present invention includes the following steps:

[0041] Lamination, making a PCB with stepped grooves by lamination;

[0042] Electroplating, forming a metallized layer on each surface of the stepped groove of the PCB, forming a metallized stepped groove;

[0043] Etching realizes the metallization of specific positions in the metal step groove and the non-metallization of other positions.

[0044] Specifically, in this embodiment, the manufacturing of the PCB with stepped grooves by lamination is as follows:

[0045] Provide an outer core plate 101 with a stepped groove opening 103 and an inner core plate 102 as the bottom layer of the groove, a filling material is set in the stepped groove opening 103, and the inner core plate 102 and the outer layer The core board 101 is laminated to form a PCB with unmetallized stepped grooves.

[0046] In this...

Embodiment 2

[0054] Such as Figures 1 to 7 As shown, in this embodiment, a method for manufacturing a stepped groove PCB according to the present invention includes the following steps:

[0055] Lamination, making a PCB with stepped grooves by lamination;

[0056] Electroplating, forming a metallized layer on each surface of the stepped groove of the PCB, forming a metallized stepped groove;

[0057] Etching realizes the metallization of specific positions in the metal step groove and the non-metallization of other positions.

[0058] Specifically, in this embodiment, the manufacturing of the PCB with stepped grooves by lamination is as follows:

[0059] Provide an outer core plate 101 with a stepped groove opening 103 and an inner core plate 102 as the bottom layer of the groove, a filling material is arranged in the opening, and the inner core plate 102 and the outer core plate 101 Lamination is performed to form a PCB with unmetallized stepped slots.

[0060] In this embodiment, th...

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Abstract

The invention discloses a manufacturing method of step groove PCB. The method comprises the following steps: lamination, i.e., manufacturing the PCB with a step groove through a lamination mode; electroplating, i.e., forming a metallization layer on each surface of the step groove of the PCB, and forming a metallization step groove; and etching, i.e., realizing metallization of a specific position in the metal step groove and non-metallization of other positions. The invention further discloses a PCB processed by use of the method. The side wall in the step groove of the PCB processed through the method is metalized, the bottom of the PCB step groove is provided with copper pins, the strength in resisting external forces is high, and the reliability is high; the side wall in the PCB step groove is metalized, a shielding effect of signal transmission is realized, and mutual interference between radio frequency components is reduced; and the PCB is provided with a non-metalized groove bottom, signals are enabled to cross the step groove during emission, and an emission and receiving loop of the signals is formed.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards and their processing, relates to a PCB and a method for manufacturing a PCB, in particular to a method for manufacturing a stepped groove PCB, in particular to a non-metallized groove bottom containing a specified layer, a groove A method for manufacturing a PCB with metallized stepped grooves. Background technique [0002] With the development of electronic product technology and the demand for multi-functionality, ladder PCB came into being. Its main functions are: improving the overall performance of the product, increasing the assembly density of the product, reducing the volume and weight of the product, increasing the heat dissipation area, and strengthening the surface element. Device security and meeting the high-speed and high-information requirements of communication products. [0003] Chinese patent document CN101662888B discloses a method for preparing a PCB board with ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0218H05K1/0296H05K2201/09845
Inventor 王洪府纪成光袁继旺肖璐
Owner DONGGUAN SHENGYI ELECTRONICS