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Composite panel, electronic equipment and manufacturing method of part of composite panel

A composite sheet and electronic equipment technology, applied in the electronic field, can solve the problems of heavy composite sheet, high cost, and poor combination of injection molding materials, etc.

Active Publication Date: 2016-07-20
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a method for making composite boards, electronic equipment and components of composite boards, which is used to solve the problem that the weight of composite boards in the prior art is relatively high, the cost is high, and in the secondary molding process, it is not compatible with injection molding materials. well-integrated issues

Method used

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  • Composite panel, electronic equipment and manufacturing method of part of composite panel
  • Composite panel, electronic equipment and manufacturing method of part of composite panel
  • Composite panel, electronic equipment and manufacturing method of part of composite panel

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Embodiment approach

[0032] An embodiment of the present invention provides a composite board, the board includes: a first board layer, a second board layer and a solid layer, the first board layer contains at least one layer of first reinforcement material; the second board layer and the first board layer Parallel, and comprising at least one layer of second reinforcing material; the solid layer is located between the first sheet material layer and the second sheet material layer, wherein the solid layer is able to pass from between the first sheet material layer and the second sheet material layer under the first preset condition protrudes from the mezzanine space between.

[0033] In the embodiment of the present invention, since the composite sheet is composed of a first sheet layer, a second sheet layer, and a solid layer located between the first sheet layer and the second sheet layer, and the material of the solid layer can use thermoplastic resin, the solid A first surface of the layer is ...

Embodiment 2

[0076] Embodiments of the present invention provide a composite sheet, such as image 3 Shown is a structural schematic diagram of another composite board provided by the embodiment of the present invention, the composite board includes:

[0077] The first board layer 31 includes at least one layer of first reinforcing material;

[0078] The second board layer 32, and includes at least one layer of second reinforcing material;

[0079] The solid layer 33 includes a first part and a second part. The first part is a protruding part in the interlayer space formed between the first sheet material layer 31 and the second sheet material layer 32 after the solid layer is subjected to pressure; the second part is located by The interlayer space formed between the first board layer 31 and the second board layer 32 is used for bonding the first board layer 31 and the second board layer 32 .

[0080] Specifically, the first reinforcing material includes at least one fiber material among ...

Embodiment 3

[0096] Based on the same inventive concept, an electronic device is also provided in an embodiment of the present invention, Figure 6 Shown is a schematic structural diagram of an electronic device provided by an embodiment of the present invention, and the electronic device includes a main body 61 and a casing 62 .

[0097] The main body 61 may contain main components of the electronic device, for example, the main body 61 may include a processor, a heat dissipation component, a signal emission source, a display unit and the like. The casing 62 can be the casing of the outer surface of the baggage main body 61, such as a casing of a mobile phone, a casing of a notebook, and the like. Generally, the housing 62 has a shape matching the main body 61 so as to be better nested with the main body, thereby protecting the components in the main body 61 and better protecting the electronic equipment.

[0098] Specifically, the housing 62 is made of a composite plate, and the composi...

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Abstract

The embodiment of the invention provides a composite panel, electronic equipment and a manufacturing method of a part of the composite panel. The sheet material comprises a first panel layer, a second panel layer and a physical layer. The first panel layer comprises at least a layer of first reinforced material and comprises at least a layer of second reinforced material. The physical layer is positioned between the first panel layer and the second panel layer. The physical layer bulges out of an interlayer space between the first panel layer and the second panel layer under a first preset condition. As the physical layer is thermoplastic resin and has light weight, the whole weight of the composite panel can be reduced. During secondary molding treatment, the physical layer can effectively prevent injection molded plastic from infiltrating the composite panel. Thus, the problem of deformation of the surface panel layer of the composite panel due to infiltration is prevented, the composite panel can remain a good shape, and product quality is raised.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to a composite board, electronic equipment and a method for making the composite board. Background technique [0002] At present, most electronic devices use composite materials as the material for the shell, so as to reduce the thickness and weight of the electronic device, and at the same time improve the protection strength of the shell for the electronic device. Usually, the composite sheet used is a composite material made by stacking the same reinforcing fiber layers, but the composite sheet of this structure is heavy in weight and high in cost, and in the secondary molding process, it is not compatible with injection molding materials combined. Contents of the invention [0003] The embodiment of the present invention provides a method for making composite boards, electronic equipment and components of composite boards, which is used to solve the problem that...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/30B32B27/06B32B27/12B32B17/10B32B17/12B32B37/06H05K5/02B29C70/38
Inventor 那志刚张春笋
Owner LENOVO (BEIJING) LTD