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Manufacturing method of electronic chip support, chip support and assembly of such support

A manufacturing method and technology of electronic chips, which are applied to the components of electronic chip supports and the field of manufacturing electronic chip supports, and can solve the problems of increased manufacturing costs and the like

Active Publication Date: 2019-04-02
LINXENS HLDG SAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This causes an increase in manufacturing cost

Method used

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  • Manufacturing method of electronic chip support, chip support and assembly of such support
  • Manufacturing method of electronic chip support, chip support and assembly of such support
  • Manufacturing method of electronic chip support, chip support and assembly of such support

Examples

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Embodiment Construction

[0048] exist figure 1 and figure 2 Above, the die support assembly 10 includes six die supports 12 . More precisely, figure 1 Surface 14 of assembly 10 corresponding to first surface 16 of each die support 12 is shown. figure 2 A surface 18 of the assembly 10 corresponding to a second surface 20 of each chip support 12 opposite the first surface 16 is shown.

[0049] The chip support assembly 10 forms a bande comprising multiple rows along the transverse dimension of the assembly 10 (i.e., along the width W10) of two columns of supports 12, one of which is along the longitudinal dimension of the assembly 10 (i.e., along the width W10). Arranged behind another column along the length L10). In fact, if figure 1 and figure 2 As shown above by the axis lines extending the assembly 10 , the assembly 10 comprises tens or several rows of two columns of supports 12 , one of which is arranged behind the other along the length L10 of the assembly 10 . Assembly 10 includes a...

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PUM

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Abstract

In the method of manufacturing the at least one electronic chip support (12), said support is made of a plate (26) comprising: a first surface (16) for contact with a chip reader; A second surface (20) covered by a first layer of conductive material (A) and intended to be coupled to a radio antenna; and a layer of electrically insulating material separating said first surface (16) from said second surface (20) Separated core (35). The method comprises the steps of: drilling at least one through-hole (36) through said board (26); placing a layer of conductive material (C) on the first surface (16); The first circuit (32) and the second circuit (34) are chemically etched on the second surface (20). According to the invention, the method comprises, prior to the step of chemical etching, the step of placing in one or more holes (36) a third layer of conductive material (D) covering the corresponding one or more The electrically insulating material in the hole (36) and electrically couples the first circuit (32) with the second circuit (34) after the chemical etching step.

Description

technical field [0001] The invention relates to a method of manufacturing an electronic chip support. The invention also relates to such an electronic chip carrier and to components of such an electronic chip carrier. Background technique [0002] In the field of electronic chip supports it is known to produce a support with two surfaces comprising a first surface intended for contact with a chip reader and a second surface opposite to said first surface , the second surface is used for coupling with a radio antenna. When the chip is connected to such a support, the terminal can establish communication with the chip either through contacts on the first surface or contactlessly through a radio antenna connected to the second surface. [0003] Figure 11 and Figure 12 Partially shown is an assembly 500 of a chip carrier 502 according to the prior art. More precisely, Figure 11 Surface 504 of assembly 500 corresponding to first surface 506 of each chip support 502 is show...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498
CPCH01L23/49827H01L2924/0002H01L23/49855H01L2924/00H01L21/486H01L23/49838H01L23/66H01L2223/6677
Inventor E·埃马尔
Owner LINXENS HLDG SAS
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