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Substrate alignment device and alignment method

A technology for aligning devices and substrates, applied in nonlinear optics, instruments, optics, etc., can solve problems such as high cost, affecting product quality, poor reliability, etc., and achieve the effects of improving efficiency, facilitating release and fixing

Inactive Publication Date: 2016-07-27
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the substrate alignment technology includes the following methods: For example, a carrier platform with fixed alignment fixtures is provided for the substrate of each product, but for substrates of various sizes, it is necessary to provide more Carrying platform, and if the size of a certain substrate is changed, the carrying platform needs to be re-provided again, which obviously costs a lot; After positioning, use positioning pins to fix the substrate, but this solution destroys the effectiveness of vacuum adsorption and affects product quality
Therefore, there are problems of high cost or poor reliability in the substrate alignment method of the current technology

Method used

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  • Substrate alignment device and alignment method

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Embodiment Construction

[0034] The implementation process of the embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0035] see figure 1 , an embodiment of the present invention provides a substrate alignment device, including a carrying platform 1 for carrying the substrate and a limiting component 2 for limiting the substrate, and the carrying platform is made of a magnetically conductive material;

[0036] The bearing surface of the bearing platform 1 is depicted with a coordinate scale line 11, and the coordinate scale line 11 is used to indicate the position coordinates of the substrate placed...

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Abstract

The invention discloses a substrate aligning device and a aligning method to realize substrate aligning with low cost and high reliability. The substrate alignment device includes a carrying platform for carrying the substrate and a limiting component for limiting the substrate, the carrying platform is made of magnetically conductive material; the carrying surface of the carrying platform is marked with coordinates scale line, the coordinate scale line is used to indicate the position coordinates of the substrate placed on the carrying platform; the limit component includes a limit arm and a magnetic adsorption structure arranged on the limit arm, the limit The positioning arm is used to limit at least two adjacent sides of the substrate placed on the carrying platform, and the limiting arm is fixed on the carrying platform through the magnetic adsorption structure.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate alignment device and alignment method. Background technique [0002] With the rapid development of display technology, liquid crystal (Liquid Crystal Display, LCD) display devices and organic light emitting diode (Organic Light Emitting Diode, LED) display devices have been used in various fields, and product types are gradually enriched, such as televisions, personal computer monitors, notebook computers, Mobile phones and car displays, etc. [0003] Although the structures of LCD display devices and LED display devices are different, for example, LCD display devices include an array substrate and a counter substrate arranged oppositely, and a liquid crystal layer between the two, and LED display devices include an array substrate and an opposite substrate arranged oppositely. , but the preparation process usually includes polarizer attachment, integrated circuit b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13
CPCG02F1/1303
Inventor 吕晶郭立勇龚增超刘宇岳福伟吴磊赵明任文福
Owner BOE TECH GRP CO LTD
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