Spraying experiment equipment

Abstract

The invention relates to spraying experiment equipment, and belongs to the field of an electronic device etching device. The spraying experiment equipment comprises a machine frame, a clamp plate groove and a clamp plate, wherein the clamp plate groove is formed in the machine frame; the clamp plate capable of sliding is arranged on the clamp plate groove; spraying devices are symmetrically arranged at the two sides of the clamp plate and are connected with a pump body through spraying pipelines; the pump body is connected with a chemical storage device. Therefore the spraying experiment equipment has the following advantages that 1, the design is reasonable; the structure is simple; the safety is high; complete practicability is realized; 2, the corrosion is uniform; the corrosion speed is high; the production efficiency can be obviously improved.

Description

technical field [0001] The invention relates to spray experiment equipment, which belongs to the field of etching devices for electronic components. Background technique [0002] Spray test equipment can be divided into chemical spray test equipment and electrolytic spray test equipment. In chemical spray, chemical solution is used to achieve the purpose of etching through chemical reaction. Chemical spraying is the technique of removing material by chemical reaction or physical impact. [0003] Spray test equipment is mainly used in aviation, machinery, and signage industries. Spray test equipment technology is widely used in the processing of weight reduction (Weight Reduction) instrument panels, nameplates and thin workpieces that are difficult to process by traditional processing methods. Etching is an indispensable technology in semiconductor and circuit board manufacturing processes. It can also etch patterns, patterns and geometric shapes on the surface of various m...

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Problems solved by technology

[0004] At present, the automatic chemical spraying experimental equipment seen in the market uses high-pressure spraying and etched linear motion to form a continuous and uninterrupted feeding state to corrode the work to improve production efficiency, but the corrosion is uneven and the pass rate is low. slow corrosion

[0005] In addition, there is also spraying experimental equipment. Generally, the basket containing the corroded silicon wafers is placed into the etching tank manually or mechanically, and the manual or mechanical hand vibrates the basket up and down or left and right, which often causes uneven corrosion. , low pass rate, slow corrosion rate, uneven cleaning

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