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Illuminating module and illuminating device comprising same

A lighting module, lighting device technology, applied in lighting devices, fixed lighting devices, lighting device components and other directions, can solve the problems of complex process, high LED temperature, poor heat conduction effect, etc., to improve heat conduction conditions and efficient heat conduction paths , the effect of reducing production costs

Inactive Publication Date: 2016-08-17
OSRAM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the design of the lighting module, there are two heat conduction interfaces between the printed circuit board and the heat sink as a heat sink, the heat conduction condition is poor, and the temperature of the LED is often high
This lighting module does not work properly for a long time
According to the requirements such as IP66 and the requirements for producing the above-mentioned metal base, the existing technical solutions often cause disadvantages such as complex process, poor heat conduction effect and high manufacturing cost

Method used

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  • Illuminating module and illuminating device comprising same
  • Illuminating module and illuminating device comprising same
  • Illuminating module and illuminating device comprising same

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Embodiment Construction

[0020] figure 1 An exploded schematic view of the lighting module 100 according to the present invention is shown. The lighting module 100 according to the present invention includes such as figure 1 The circuit board 1 shown is a lens 2 for covering the light-emitting element 3 arranged on the first side of the circuit board 1 . The light emitting element 3 according to the embodiment of the present invention can preferably be designed as an LED. In addition, in order to manufacture the lens 2 and the circuit board 1 into a package, an encapsulation material 4 is also provided on the first side of the circuit board 1, wherein the encapsulation material 4 can protect the bonding area between the lens 2 and the circuit board 1 The gap is filled.

[0021] When the encapsulation material 4 is arranged on the circuit board 1, since the initial state of the encapsulation material 4 is often liquid or gel-like, such as a potting material, a frame 5 is also preferably provided on ...

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PUM

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Abstract

The invention relates to an illuminating module and an illuminating device comprising the same. The illuminating module comprises a circuit board and a lens for covering a light emitting part on the circuit board. The lens is arranged on a first side face, where the light emitting part is mounted, of the circuit board, and a packaging body for packaging the light emitting part is jointly formed by the lens and the first side face.

Description

technical field [0001] The invention relates to a lighting module and a lighting device including the lighting module. Background technique [0002] In outdoor lighting applications, LED lighting modules often do not require heat sinks but need to achieve industrial protection levels such as IP66, so users can use the lighting modules on platforms with different types of heat sinks. In the conventional technology, such a lighting module is realized by using a flat metal base instead of a bulky heat sink. [0003] Specifically, a lighting module is proposed in the prior art, and the lighting module has a flat metal base for use on different heat sinks. However, according to the design of the lighting module, there are two heat conduction interfaces between the printed circuit board and the heat sink as a heat sink, the heat conduction conditions are poor, and the temperature of the LED is often high. This lighting module cannot work normally for a long time. According to r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/00F21V29/50F21V19/00H01L33/56H01L33/64F21Y101/02
Inventor 张新建冯耀军
Owner OSRAM GMBH
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