High power LED (light-emitting diode) daylight lamp and heat rejection method

A LED fluorescent lamp, high-power technology, applied in the direction of light source, electric light source, light source fixing, etc., can solve the problems of heat dissipation and defects, and achieve the effect of smooth heat conduction, good heat dissipation effect, and large contact area

Inactive Publication Date: 2012-10-17
XIZHUO ELECTRONICS TECH SHANGHAI
View PDF9 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regardless of one or two, the packaged LEDs are installed on the circuit board, and there are multiple layers of thermal resistance interfaces for heat conduction and heat dissipation, resulting in poor heat dissipation
At present, the design scheme of using double-sided copper foil urea or fiberboard or semi-fiberboard as the bracket and circuit substrate for LED die-bonding, and directly packaging it into a light source for high-power LED fluorescent lamps has not been disclosed in relevant literature.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High power LED (light-emitting diode) daylight lamp and heat rejection method
  • High power LED (light-emitting diode) daylight lamp and heat rejection method
  • High power LED (light-emitting diode) daylight lamp and heat rejection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0022] refer to Figure 1-Figure 7 , the high-power LED fluorescent lamp is rod-shaped, including a light source 1 and a lamp housing 2 .

[0023] The light source 1 is made of a number of LED chips 12 directly bonded to the front of the circuit substrate 11. The circuit substrate 11 is a double-sided copper-clad laminate. The back of the circuit substrate 11 is completely covered with copper foil. Die-bonding area 112 and current channel 111, gold wire welding area 114 is set near the crystal-bonding area 112 on the current channel 111, and gold wire welding area 114 is connected with the LED chip 12 of solid crystal in the crystal-bonding area by gold wire 13, each The LED chip 12 and its gold wire are packaged with a hemispherical fluorescent silica gel 14 , and the die-bonding area 112 is provided with a thermal conduction hole (ie, a metallized ho...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a high power LED (light-emitting diode) daylight lamp and a heat rejection method. The daylight lamp comprises a light source and a lamp shell, wherein the light source is produced in a way that a plurality of LED chips are directly arranged on the frontage of a circuit baseplate in a crystal fixing manner, and a copper foil is covered on the whole back of the circuit baseplate; the frontal copper foil is divided into a plurality of crystal fixing regions and current channels, the current channels are connected with the LED chips of the crystal fixing regions by gold threads, and the crystal fixing regions are provided with heat conduction holes; and the lamp shell is of a rod shape, the section of the lamp shell is composed of a semicircular aluminum pipe, a transparent cover and two end covers, the light source is arranged outside the aluminum pipe, and the back copper foil of the circuit baseplate is closely contacted with the bottom wall of the aluminum pipe. The production of the high power LED daylight lamp is simple, the light effect is high, a thermal resistor interface is less, and the heat rejection effect is good.

Description

technical field [0001] The invention relates to an LED fluorescent lamp, in particular to a high-power LED fluorescent lamp and a heat dissipation method thereof. Background technique [0002] Traditional fluorescent lamps commonly used in indoor lighting have the disadvantages of short life, high energy consumption, mercury pollution, and flickering. Therefore, people have developed LED fluorescent lamps for solid-state lighting. The existing high-power LED fluorescent lamps have serious heat dissipation problems. , light field, and light attenuation have not been truly resolved. Especially for high-power LED fluorescent lamps that use urea board or fiberboard as the circuit board, it is even more serious. High-power LED fluorescent lamps on the market use the following two light sources: 1. The LED plug-in circuit of single-particle bead-shaped packaging on urea board or fiberboard The board is used as a light source, and the second is a single-particle patch-type package...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V17/00F21V19/00F21V23/06F21V29/00F21V13/00F21Y101/02F21V29/83
Inventor 杨然森
Owner XIZHUO ELECTRONICS TECH SHANGHAI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products