A white light scanning interferometry method and system

A technology of white light scanning and interferometry, which is applied in the direction of measuring devices, optical devices, instruments, etc., can solve problems such as large errors, and achieve the effect of wide application and strong anti-noise performance
CN105865370BActive Publication Date: 2019-04-19SOUTH CHINA NORMAL UNIVERSITY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SOUTH CHINA NORMAL UNIVERSITY
Publication Date
2019-04-19

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Abstract

The invention relates to a white-light scanning interferometry measurement method and system. The system comprises a white-light scanning module, a calibration module, a fixed flat plate and a piezoelectric ceramic micro displacement platform, wherein the white-light scanning module comprises a white light source, a Kohler illumination system, a first beam splitter, a second beam splitter, a first microobjective, a second microobjective, an imaging lens, first, second, third, fourth and fifth plane mirrors and a first single-color black-and-white image sensor; the calibration module comprises a laser and a second single-color black-and-white image sensor. According to the system and the method, the central wavelength of a light source is not required to be calibrated, the calculation accuracy is not affected by enveloping shapes of interference signals, the anti-noise performance is good, and the method and the system can be widely applied to signal processing of white-light scanning interferometry measurement.
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Description

technical field

[0001] The invention relates to the field of white light scanning interference three-dimensional shape measurement, in particular to a white light scanning interferometry method and system based on generalized correlation time delay estimation. Background technique

[0002] As a three-dimensional shape measurement method, white light scanning interferometry is widely used in the three-dimensional shape measurement of microscopic objects and the surface roughness measurement of objects. With the development of precision manufacturing, it is necessary to measure the three-dimensional shape of some MEMS devices, semiconductor chips and other objects whose surface height jumps from hundreds of nanometers to hundreds of microns. Currently used probe-type measurement methods such as atomic force microscopes and spherometers have certain limitations and are not suitable for the three-dimensional shape measurement of such objects.

[0003] Moreover, the white light ...

Claims

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