Effect Evaluation Method of Electroplating Copper Potion

An evaluation method and technology of electroplating copper, applied in the direction of electrochemical variables of materials, etc., can solve the problems of measurement accuracy affecting the reliability of conclusions, large workload, long test cycle, etc., to achieve rapid evaluation, short evaluation cycle, and small workload. Effect

Active Publication Date: 2018-10-30
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

This method has a large workload, long test cycle, slice production level, measurement accuracy, etc. will affect the reliability of the conclusion; and there is no inherent relationship between the various factors of the experimental investigation and the final result (deep plating ability or leveling ability) Mechanism-mechanism connection, a small amount of individual data is difficult to use to guide the next experiment

Method used

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  • Effect Evaluation Method of Electroplating Copper Potion
  • Effect Evaluation Method of Electroplating Copper Potion
  • Effect Evaluation Method of Electroplating Copper Potion

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Bath solution to be tested: SkyPlate Cu627 from Tiancheng Chemical Co., Ltd., whose initial components before preparation are shown in Table 1, named Cu627 VMS (virgin make up solution).

[0036] Table 1

[0037] Element

concentration

CuSO 4 ·5H 2 o

85g / L

50%H 2 SO 4

440g / L

NaCl

90.5mg / L

[0038] Analytical device: such as figure 1 As shown, the analysis device includes an analysis cup 1 and a working electrode 2 inserted into the analysis cup 1, a reference electrode 3 and an auxiliary electrode 4, the upper end of the working electrode 2 is provided with a rotating electrode device 5, the working electrode 2, the reference electrode 3 and the The auxiliary electrodes 4 are electrically connected to the electrochemical workstation 6 respectively, the reference electrode 3 is connected to the copper electroplating solution in the analysis cup 1 through the salt bridge, and the electrochemical workstation 6 is c...

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Abstract

The invention discloses an electro-coppering liquid medicine effect evaluation method and provides a testing device. The testing device comprises electrodes arranged in an analyzer cup, an electrochemical workstation electrically connected with the electrodes and a computer electrically connected with electrochemical workstation. The electrodes include the reference electrode, the auxiliary electrode and the working electrode. The reference electrode is connected with electro-coppering liquid medicine in the analyzer cup through a salt bridge. Copper ions in the electro-coppering liquid medicine are plated to the working electrode under different electroplating voltages, then, an LSV method is used for peeling off copper on the working electrode, the copper plating amount is worked out, and the smaller the copper plating amount is along with changes of the electroplating voltage, the better the leveling and pore-filling effects of the electroplating liquid medicine are. According to the effect evaluation method, the effect of the electro-coppering liquid medicine can be rapidly evaluated, the workload is small, the evaluation period is short, and efficiency is high.

Description

technical field [0001] The invention relates to electroplating technology, in particular to an effect evaluation method of electroplating copper potion. Background technique [0002] At present, the development and testing of electroplating solutions are mainly to conduct electroplating experiments on small plates in Harlem tanks, and then to evaluate the electroplating effect in the holes through the method of slice observation. This method has a large workload, long test period, slice production level, measurement accuracy, etc. will affect the reliability of the conclusion; and there is no inherent relationship between the various factors of the experimental investigation and the final result (deep plating ability or leveling ability) Mechanism-mechanism connection, a small amount of individual data is difficult to use to guide the next experiment. Contents of the invention [0003] The object of the present invention is to provide a method for evaluating the effect of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/48G01N27/30
CPCG01N27/30G01N27/48
Inventor 冯建松章晓冬刘江波童茂军王亚军
Owner GUANGDONG SKYCHEM TECH LTD
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