Electrode structure and the corresponding electrical component using the same and the fabrication merhod thereof

一种电子元件、电极结构的技术，应用在电气元件、变压器/电感的零部件、线圈制造等方向，能够解决短路、电极电阻值变化很大、电镀材料扩散等问题

Active Publication Date: 2016-08-24
CYNTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resistance value of electrodes manufactured by traditional electroplating methods varies greatly, which reduces the electrical performance in some applications and even affects the production yield of electronic components
On the other hand, electroless plating is prone to the problem of plating spread, causing the plating material to spread to some unwanted areas and even cause short circuits

Method used

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  • Electrode structure and the corresponding electrical component using the same and the fabrication merhod thereof
  • Electrode structure and the corresponding electrical component using the same and the fabrication merhod thereof
  • Electrode structure and the corresponding electrical component using the same and the fabrication merhod thereof

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Embodiment Construction

[0044] A detailed description of the invention is described below. The embodiments disclosed below are used to illustrate and describe the technical contents and effects of the present invention, and are not intended to limit the scope of the present invention.

[0045] An electronic component is disclosed in the following embodiments, the electronic component includes: a body and an electrode structure disposed on a first surface of the body, the electrode structure includes an inner metal layer and an outer metal layer, wherein the electronic component A terminal of a conductive element is arranged between the inner metal layer and the outer metal layer, the terminal of the conductive element of the electronic component is electrically connected to the inner metal layer and the outer metal layer, and the terminal of the conductive element is used to electrically connect an external circuit .

[0046] like figure 1Shown is a structural cross-sectional view of an embodiment ...

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Abstract

An electrical component is disclosed, wherein the electrical component comprises: a body and an electrode structure disposed on a first surface of the body, wherein the electrode structure comprises an inner metal layer and an outer metal layer, wherein a terminal of a conductive element of the electrical component is disposed between the inner metal layer and the outer metal layer, wherein the terminal of the conductive element of the electrical component is electrically connected to the inner metal layer and the outer metal layer for electrically connecting with an external circuit.

Description

technical field [0001] The invention relates to an electronic component, in particular to an electrode structure of the electronic component. Background technique [0002] As electronic components or electronic devices become smaller and smaller, the size and reliability of electrode structures become technical bottlenecks that affect the electrical performance and reliability of electronic components. The electrode structure is used to electrically connect the electronic component and an external circuit, such as a printed circuit board (PCB), and the terminals of the conductive components of the electronic component are electrically connected to the corresponding electrodes, such as surface-mount pads (surface-mount pads) To be soldered to the corresponding soldering point of the PCB. Lead frame (Lead frame) is usually soldered to the terminal of electronic components, however, lead frame usually occupies a considerable space with electronic components, therefore, lead fr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/04H01F27/29H01F27/24H01F41/04
CPCH01F27/292H01F17/045H01F27/2847H01F41/10H01F41/12Y10T29/49075
Inventor 李奇勋李政璋陈易威
Owner CYNTEC
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