Flexible printed circuit board connection interface and flexible printed circuit board structure
A flexible circuit board and flexible circuit substrate technology, applied in the electronic field, can solve problems such as poor contact, damage, excessive bending, etc., and achieve the effects of stable magnetism, low price, and good thermal conductivity
Active Publication Date: 2018-07-24
CHANGZHOU INST OF PRINTED ELECTRONICS IND CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] In order to overcome the defects of the existing technology, a flexible circuit board connection interface and a flexible circuit board structure are provided to solve the problem of poor contact and excessive bending of the existing flexible circuit board connection interface during the bending process. Damage and other issues
Method used
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Embodiment Construction
[0024] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0025] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not intended to limit the present invention Therefore, it has no technical substantive meaning, and any modification of structure, change of proportional relationship ...
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The invention provides a structure. The flexible printed circuit board connection interface comprises a connector formed by ferrogum, wherein the connector is provided with a plug groove; a first insulation bonding layer paved to the groove bottom of the plug groove; a first conductive layer paved on the first insulation bonding layer; a plug board formed by ferrogum and plugged to the plug groove; a second insulation bonding layer paved on the plug board; and a second conductive layer paved on the second insulation bonding layer. When the plug board is plugged in the plug groove, the second conductive layer is fit to the first conductive layer correspondingly. The ferrogum is utilized to form the connector and the plug board; the plug board is plugged in the plug groove; the first insulation bonding layer and the first conductive layer are paved on the groove bottom of the plug groove, and the second insulation bonding layer and the second conductive layer are paved on the plug board to enable the connector and the plug board to serve as the flexible printed circuit board connection interface; and therefore, the problem that an existing flexible printed circuit board connection interface is easy to damage and the like due to over bending in the bending process is solved.
Description
technical field [0001] The invention relates to the field of electronic technology, in particular to a flexible circuit board connection interface and a flexible circuit board structure. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board), also known as "FPC flexible board", is a printed circuit made of flexible insulating substrates, which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC flexible boards can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC flexible boards ...
Claims
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IPC IPC(8): H01R12/78H01R13/02H01R13/502H01R13/62H05K1/11
CPCH01R12/78H01R13/02H01R13/502H01R13/6205H05K1/118
Inventor 曹卓张霞昌郭小军王若琳徐玉含
Owner CHANGZHOU INST OF PRINTED ELECTRONICS IND CO LTD