Substrate deviation correction apparatus, substrate deviation correction method, and carrier platform equipped with substrate deviation correction apparatus
A technology for correcting devices and substrates, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as cracking and bending of the substrate 400, and achieve the effect of avoiding bending and cracking
Active Publication Date: 2016-09-21
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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Problems solved by technology
However, due to the vacuum adsorption force on the surface of the stage 300, the vacuum adsorption force will absorb the upper substrate 400 downward, and the shifted substrate 400 cannot be adsorbed and fixed on the stage 300 under the action of the vacuum adsorption force. The force between the substrate 400 and the positioning pin 301 is strengthened, and the substrate 400 is prone to problems such as bending or even cracking
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[0021] In order to further explain the technical means and effects adopted by the present invention to achieve the intended invention purpose, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0022] Figure 5 It is a schematic structural diagram of the carrier platform of the embodiment of the present invention, please refer to Figure 5 As shown, the stage 100 of the present invention includes a stage body 10 and a substrate deviation correction device 20 .
[0023] The carrier body 10 is a planar rectangular structure. The surface of the carrier body 10 is smooth for holding the substrate 200. The four corners of the lower end of the carrier body 10 are respectively provided with legs (not shown in the figure), and the lower ends of the legs are located on the ground. The legs can be materials such as angle steel, angle iron, angl...
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The invention provides a substrate deviation correction apparatus. The substrate deviation correction apparatus comprises multiple deviation sensing structures and deviation adjusting apparatuses, wherein the multiple deviation sensing structures are arranged around the edges of the surface of the carrier platform body; the deviation sensing structures comprise positioning pins which can be extendible up and down, light source emitters and light source sensors which are arranged on the two sides of the corresponding positioning pins; the light source sensors are electrically connected with the corresponding deviation adjusting structures; the deviation adjusting structures comprise air-blowing adjusting structures and air-blowing matching structures; the air-blowing matching structures are arranged on the surface of the carrier platform body and can blow air in the vertical direction to support the deviated substrate; and the air-blowing adjusting structures are arranged on the inclined planes of the corresponding positioning pins, and can blow air in the horizontal direction towards the inner side of the carrier platform body so as to adjust the relative position of the substrate. The invention also provides a substrate deviation correction method for the substrate deviation correction apparatus, and the carrier platform equipped with the substrate deviation correction apparatus.
Description
technical field [0001] The invention relates to the field of display technology, and in particular to a substrate deviation correction device, a substrate deviation correction method and a stage with the substrate deviation correction device. Background technique [0002] At present, the laser crystallization device transports the substrate to the stage through a robot arm, and positions the substrate through positioning pins provided on the edge of the stage. figure 1 is a schematic diagram of the structure of the existing carrier, figure 2 yes figure 1 For the cross-sectional view at Ⅱ-Ⅱ, see figure 1 and figure 2 As shown, a plurality of pairs of positioning pins 301 are provided on the surface edge of the stage 300 , and the positioning pins 301 cooperate with a robot arm (not shown in the figure) so that the substrate 400 is placed on the stage 300 in alignment. [0003] When the robot arm places the substrate 400, it may cause the actual placement position of the...
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IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67259H01L21/68
Inventor 李辉
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD