Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for manufacturing metal circuit board

A production method and metal circuit technology, applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of easy damage to the circuit, and achieve the effect of not easy to burn out and good production stability.

Inactive Publication Date: 2016-09-21
共青城超群科技协同创新股份有限公司
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional circuit boards are based on insulating materials. Although the cost is low, there is a problem that the circuit is easy to be damaged.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. A method for manufacturing a metal circuit board, characterized in that it comprises the following steps:

[0020] (1) Pre-treatment: 0.1-0.2mm copper alloy plate is used as raw material, degreasing treatment is performed, and then cleaned with pure water to remove surface pollutants;

[0021] (2) Lamination: Use a vacuum laminator to form a photosensitive dry film on the surface of the metal plate coated with an antioxidant layer;

[0022] (3) Film alignment: double-sided film alignment according to the design graphi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for manufacturing a metal circuit board. The method comprises the steps of (1) preprocessing, (2) film pressing, (3) film alignment, (4) exposure (5) development, (6) etching, (7) film stripping, (8) surface acetylation, (9) silver plating, and (10) the manufacturing of an insulation material in an etching groove. According to the method, the limitation of a traditional thinking is broken, with metal material as a base material, the insulation material is processed and made on the metal material, and the stability of the manufactured circuit board is good.

Description

technical field [0001] The invention relates to a method for manufacturing a metal circuit board, belonging to the technical field of circuit board processing. Background technique [0002] Traditional circuit board production is to make metal circuit layers on resin materials. The main process is: material cutting --- drilling --- sinking copper --- circuit --- drawing electricity --- etching -----Solder mask---Character----HASL (or immersion gold)-gong edge-v cutting (some boards do not need)-----flying test--vacuum packaging. Traditional circuit boards are based on insulating materials. Although the cost is low, there is a problem that the circuit is easily damaged. Contents of the invention [0003] The purpose of the present invention is to provide a method for making a metal circuit board, which breaks through the limitations of traditional thinking, uses metal materials as base materials, and processes insulating materials on the metal materials to produce circuit ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/05
CPCH05K1/056
Inventor 黄琦鲍量黄强
Owner 共青城超群科技协同创新股份有限公司