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RTM technological method for manufacturing anti-spill glue quick connection device

A technology of connection device and process method, which is applied in the field of composite material manufacturing, can solve the problems of low production efficiency, cumbersome work process, frequent repair of molds, etc., and achieve the effect of high work efficiency

Active Publication Date: 2016-09-28
JIANGXI HONGDU AVIATION IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the above connection method is used, multiple connections between the conversion joint and the threaded hole at the injection / glue outlet will easily lead to thread slippage, and the through hole at the lower end of the mold threaded hole will be filled with excess glue, and the hole needs to be cleared every time it is used Drilling and clearing the glue will definitely damage the mold, and usually there are more than 20 injection / glue outlets on a set of molds, resulting in cumbersome work process, low production efficiency, and the reduction of air tightness of the mold, frequent mold repairs risks of

Method used

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  • RTM technological method for manufacturing anti-spill glue quick connection device
  • RTM technological method for manufacturing anti-spill glue quick connection device
  • RTM technological method for manufacturing anti-spill glue quick connection device

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Embodiment Construction

[0024] The present invention is described in detail below in conjunction with accompanying drawing:

[0025] An RTM process method for manufacturing an anti-overflow glue quick connection device:

[0026] 1. Manufacture the anti-overflow glue quick connection device: the material is steel, and the device is divided into two parts: the fixed nut 1 and the hollow bolt 2;

[0027] 2. The fixed nut 1 is in the shape of a hexagon, and its lower surface matches the mold surface to make a through hole along the center of the nut, and then use a tap to make a threaded hole through the through hole;

[0028] 3. Three screw holes 3 are evenly distributed on the upper surface of the fixing nut 1, and an annular sealing groove is made on the lower surface, and the sealing rubber ring 4 is filled to ensure the airtightness of the mold and the quick connection device;

[0029] 4. The hollow bolt 2 is in the shape of a countersunk head rod. There is a sealing washer 5 at the joint between t...

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Abstract

The invention relates to an RTM technological method for manufacturing an anti-spill glue quick connection device, and belongs to the technical field of manufacturing of composites. According to the method, a glue injection / outlet pipeline is connected with a mold through utilizing the anti-spill glue quick connection device, after parts are heated and cured, the device can be reutilized through only taking down a hollow bolt of the device to be fired at a high temperature, residual glue in a mold hole does not need to be removed, the working efficiency is high, and the mold is not damaged.

Description

technical field [0001] The invention relates to an RTM process method for manufacturing an anti-overflow glue quick connection device, and belongs to the technical field of composite material manufacturing. Background technique [0002] Resin Transfer Molding (RTM) is one of the most commonly used liquid molding process technologies for research on low-cost manufacturing technology of high-performance advanced composite materials. solidification process. Therefore, the RTM process has higher requirements on the airtightness of the mold. [0003] Generally, the connection between the injection / discharge pipeline and the mold during the RTM process is to connect the adapter, brass ball valve, pagoda joint, and injection / discharge pipe in sequence through the threaded holes on the mold. After the parts are heated and solidified, remove the conversion joints, brass ball valves, pagoda joints, and injection / discharge hose parts. After opening the mold and taking out the parts, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/48B29C70/54
CPCB29C70/48B29C70/54
Inventor 李延平殷俊李云龙马军辛洪南郭丽平张东生瞿绍奇郭蕊娜赵胜男刘晓雯
Owner JIANGXI HONGDU AVIATION IND GRP
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