3d global pixel unit and preparation method thereof
A pixel unit, global technology, applied in electrical components, radiation control devices, semiconductor/solid-state device manufacturing, etc., can solve the problem of photodiodes, storage capacitors and readout circuits easily interfering with each other, to improve optical isolation, improve Light path, the effect of reducing the chip area
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[0039]In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.
[0040] The 3D global pixel unit of the present invention is at least composed of a photosensitive area fabricated on the first silicon substrate layer and a signal storage and readout circuit area fabricated on the second silicon substrate layer; the photosensitive area is located in the signal storage and readout circuit area Above; the photosensitive area has a photosensitive diode located on the first silicon substrate layer, the signal storage and readout circuit unit area has a signal storage and readout circuit located on the second silicon substrate layer, and...
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