Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor device

A technology for semiconductors and shells, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of high cost and high manufacturing cost, and achieve the effect of suppressing increase and suppressing welding parts

Active Publication Date: 2019-06-07
株式会社PANGEA
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cost of soldering such as SMT is high, if the number of soldered parts increases, the manufacturing cost will increase accordingly.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0026] figure 1 This is a diagram showing a configuration example of a plug-integrated semiconductor device that can perform data transfer using USB 3.0 by connecting to a socket. In addition, if it is a specification that uses the same signal, it can also be used as a semiconductor device that can use other USB specifications for data transfer. figure 1 The illustrated semiconductor device 1 includes a case 11, a circuit board 12 having four external connection terminals 125 provided in the case 11, and five external connection terminals 13. figure 1 Here, for convenience, a part of the housing 11 is shown by a broken line, and a boundary between the solid line and the broken line is shown by a wavy line.

[0027] As the external connection terminal 125, the power supply terminal (VBUS), the signal terminal (D+, D-) and the ground terminal (GND) used for the normal transmission of the differential signal as the data signal for the normal transmission, etc., use USB2.0 or USB3.0 E...

no. 2 Embodiment approach

[0058] Figure 8 and Picture 9 It is a diagram showing a configuration example of a plug combination type semiconductor device that can perform data transfer using USB by connecting to a socket. Figure 8 Is a schematic view from the side, Picture 9 It is a schematic view viewed from the upper surface direction. In addition, Figure 8 and Picture 9 For convenience, some components are not shown.

[0059] Figure 8 and Picture 9 The illustrated semiconductor device 2 includes a case 21, a circuit board 22, and a plug 23. In addition, the description of the case 21 and the circuit substrate 22 can be appropriately cited figure 2 Description of the housing 11 and the circuit substrate 12 shown.

[0060] The housing 21 includes an opening 210. The inner wall of the opening 210 has an insertion hole 24a and a groove 24b. The planar shape of the insertion hole 24a and the groove part 24b is rectangular, but it is not limited to this. In addition, the insertion hole 24a may be a t...

no. 3 Embodiment approach

[0072] Picture 12 It is a diagram showing a configuration example of a semiconductor device that can perform data transfer using USB 3.0 by connecting to a socket. In addition, if it is a standard that uses the same signal, it can also be used as a semiconductor device that can perform data transfer using other USB standards. Picture 12 The illustrated semiconductor device 3 includes a case 31, a circuit board 32, and external connection terminals 33. In addition, as the description of the case 31, the circuit substrate 32, and the external connection terminal 33, it is possible to appropriately cite figure 2 Description of the housing 11, the circuit substrate 12, and the external connection terminals 13 shown.

[0073] The housing 31 includes an opening 310. A convex portion 311 is provided on the inner wall of the opening 310. The housing 31 is formed of, for example, a material applicable to the housing 11. For example, the housing 31 having the opening 310 may be formed...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present invention is provided to inhibit an increase of soldering portion. The embodied semiconductor device is capable of using USB to perform data transmission through connection to a socket, and includes a housing, a circuit substrate, and second external connection terminals. The housing is provided with an opening portion. The circuit substrate is inserted into the opening portion and includes: a wiring substrate including a plurality of connection pads having first external connection terminals capable of connecting to the socket; and a semiconductor chip disposed on the wiring substrate. The second external connection terminal includes: a fixed portion fixedly connected to an inner wall of the opening portion; a socket connection portion arranged on the same surface as the fixed portion for connection to the socket; and a first pad connection portion and a second pad connection portion that are arranged on the opposite surfaces relative to the fixed portion and electrically connected to at least one of the plurality of connection pads.

Description

[0001] [Related Application Case] [0002] This application enjoys priority based on Japanese Patent Application No. 2014-188532 (filing date: September 17, 2014). This application includes all the contents of the basic application by referring to the basic application. Technical field [0003] The invention of the embodiment relates to a semiconductor device. Background technique [0004] As one of the connection specifications when connecting information equipment such as a computer and peripheral equipment, USB (Universal Serial Bus) is known. For example, by using a USB connector that includes a male connector (also called a plug) and a female connector (also called a socket) to connect an information device and a peripheral device, not only can data be transmitted, for example, the peripheral device can also be obtained from the information device. Power supply necessary for operation, or connect multiple devices via a USB hub. [0005] In USB3.0, one of the USB specifications...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/02H01L23/48
CPCH01L2224/48091H01L2224/49175H01L2924/181H01L2924/00012H01L2924/00014
Inventor 佐藤宏贵向田秀子藤巻明子筑山慧至尾山胜彦小坂善幸渡辺章雄原嶋志郎安达浩祐松浦永悟山口量平土肥雅之
Owner 株式会社PANGEA