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A kind of insulating flame retardant epoxy resin coating for circuit board and preparation method thereof

A technology of epoxy resin coating and epoxy resin, applied in the direction of epoxy resin coating, fireproof coating, coating, etc., can solve the problems of flame retardancy and poor insulation, and achieve the effect of good flame retardant effect.

Active Publication Date: 2018-08-24
江苏中任油漆有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of poor flame retardancy and poor insulation of coatings used on circuit boards, mainly by modifying epoxy resins.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The insulating flame-retardant epoxy resin coating used for the circuit board is prepared from the following components by weight: 40 parts of modified epoxy resin, 10 parts of curing agent, 5 parts of amino silicone oil, 10 parts of flame retardant (bromine Polystyrene and antimony trioxide mixed in a weight ratio of 1:2), 15 parts of filler aluminum hydroxide, 3 parts of wetting agent, 3 parts of thickener xanthan gum, 2 parts of dispersant, 1 part of film-forming aid 1 part, 1 part of defoamer, 2 parts of rheological additive, 1 part of anionic surfactant, 30 parts of solvent ethyl acetate.

[0036] Described modified epoxy resin refers to modified E20 epoxy resin, prepared through the following steps:

[0037] Step 1, in parts by weight, 20 parts of tung oil, 65 parts of isomerized heptaol, and 0.09 parts of sodium hydroxide catalyst undergo alcoholysis reaction, the reaction temperature is 225 ° C, and the reaction time is 6 hours to obtain the first reactant;

[...

Embodiment 2

[0043] The insulating flame-retardant epoxy resin coating used for circuit boards is prepared from the following components in parts by weight: 60 parts of modified epoxy resin, 15 parts of curing agent, 10 parts of amino silicone oil, and 15 parts of flame retardant (bromine Polystyrene and antimony trioxide mixed in a weight ratio of 1:2), 20 parts of filler aluminum hydroxide, 5 parts of wetting agent, 5 parts of thickener xanthan gum, 4 parts of dispersant, 2 parts of film-forming aid 3 parts, 3 parts of defoamer, 4 parts of rheology additive, 3 parts of anionic surfactant, 40 parts of solvent ethyl acetate.

[0044] Described modified epoxy resin refers to modified E20 epoxy resin, prepared through the following steps:

[0045] Step 1, in parts by weight, 20 parts of tung oil, 65 parts of isomerized heptaol, and 0.09 parts of sodium hydroxide catalyst undergo alcoholysis reaction, the reaction temperature is 225 ° C, and the reaction time is 6 hours to obtain the first re...

Embodiment 3

[0051] The insulating flame-retardant epoxy resin coating used for circuit boards is prepared from the following components in parts by weight: 50 parts of modified epoxy resin, 12 parts of curing agent, 8 parts of amino silicone oil, and 12 parts of flame retardant (bromine Polystyrene and antimony trioxide mixed in a weight ratio of 1:2), 18 parts of filler aluminum hydroxide, 4 parts of wetting agent, 4 parts of thickener xanthan gum, 3 parts of dispersant, 1 part of film-forming aid 2 parts, 2 parts of defoamer, 3 parts of rheology additive, 2 parts of anionic surfactant, 38 parts of solvent ethyl acetate.

[0052] Described modified epoxy resin refers to modified E20 epoxy resin, prepared through the following steps:

[0053] Step 1, in parts by weight, 18 parts of tung oil, 55 parts of isomerized heptaol, and 0.07 parts of sodium hydroxide catalyst undergo alcoholysis reaction, the reaction temperature is 210 ° C, and the reaction time is 5 hours to obtain the first reac...

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PUM

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Abstract

The invention relates to insulated flame-retardant epoxy resin coating used for a circuit board and a preparation method of the insulated flame-retardant epoxy resin coating, and belongs to the technical field of flame-retardant coatings. The insulated flame-retardant epoxy resin coating is prepared from the following components in parts by weight: 40 to 60 parts of modified epoxy resin, 10 to 15 parts of curing agent, 5 to 10 parts of amino silicon oil, 10 to 15 parts of flame retardant, 15 to 20 parts of filler, 3 to 5 parts of wetting agent, 3 to 5 parts of thickening agent, 2 to 4 parts of dispersing agent, 1 to 2 parts of coalescing agent, 1 to 3 parts of defoaming agent, 2 to 4 parts of rheological agent, 1 to 3 parts of anionic surfactant and 30 to 40 parts of solvent. The insulated flame-retardant epoxy resin coating provided by the invention has the advantages of good adhesion with the circuit board, good insulativity and good flame-retardant effect.

Description

technical field [0001] The invention relates to an insulating flame-retardant epoxy resin coating used for circuit boards and a preparation method thereof, belonging to the technical field of flame-retardant coatings. Background technique [0002] The circuit board is a substrate carrying electronic components. It is based on direct materials, combined with some indirect materials, and processed through production tools. Among them, direct materials refer to the main materials that are directly used on the product or in direct contact with the product during production; indirect materials refer to the secondary materials that are indirectly used on the product or indirectly contact with the product during production. There are three main direct materials in the production of circuit boards, namely base material, prepreg and copper foil. The substrate (core / laminte) is pressed from prepreg and copper foil. Prepreg is made of resin, glass cloth combined with different reinfo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D163/00C09D5/25C09D5/18C09D7/61C09D7/65C08G59/14
CPCC08G59/1422C08G59/1433C08L2201/02C08L2203/20C08L2205/035C09D5/18C09D7/61C09D7/65C09D163/00C08L83/08C08L25/06C08K13/02C08K3/2279C08K2003/2227
Inventor 关亚玲
Owner 江苏中任油漆有限公司