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Silicon wafer batch management method and system

A management method, silicon wafer technology, applied in manufacturing computing systems, data processing applications, instruments, etc., and can solve problems such as cross-contamination

Inactive Publication Date: 2016-10-26
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the above problems, the present invention aims to provide a silicon wafer batch management method and system, so as to realize the operation and control of automatic batch aggregation or disbandment of the system, avoid cross-contamination, and realize the emphasis on special products control

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  • Silicon wafer batch management method and system
  • Silicon wafer batch management method and system
  • Silicon wafer batch management method and system

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Embodiment Construction

[0029] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0030] The following is attached Figure 1-2 The present invention will be described in further detail with specific examples. It should be noted that the drawings are all in a very simplified form, using imprecise scales, and are only used to facilitate and clearly achieve the purpose of assisting in describing the present embodiment.

[0031] In this embodiment, the silicon wafer batch management method is applied to the silicon wafer processing flow; the silicon wafer processing flow includes various preparation processes of silicon wafers, such as: active area...

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Abstract

The invention relates to a silicon wafer batch management method and system, wherein the method and system are applied to a silicon wafer processing flow. The method comprises: an accumulation rule and flow accumulation levels are set, wherein the flow accumulation levels include different accumulation types; silicon wafer batches meeting the flow accumulation levels and / or the accumulation rule are selected; and then the silicon wafers are transferred. Therefore, the operation and control on automatic batch accumulation or distribution of the system are realized; a cross contamination phenomenon is avoided; and priority control on special products is realized.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a silicon wafer batch management method and system. Background technique [0002] In the existing integrated circuit manufacturing industry, silicon wafers are generally placed in a loading box with 25 pieces as a product lot (Lot), and related equipment and systems are also optimized for production capacity based on 25 pieces. However, in actual production, the number of silicon wafers in the silicon wafer loading box is often less than 25 due to various requirements, and due to the production requirements of some equipment and processes, silicon wafers with the same conditions must be placed in the same Wafer cassettes are then produced together, so wafers of different conditions need to be placed in different wafer cassettes. This not only greatly increases the demand for silicon wafer loading boxes in the manufacturing plant, but also greatly increases the equipm...

Claims

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Application Information

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IPC IPC(8): G06Q50/04H01L21/673H01L21/66H01L21/67
CPCY02P90/30G06Q50/04H01L21/67242H01L21/67265H01L21/673H01L22/34
Inventor 马兰涛陈毅俊朱骏
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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