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A thermally driven mems device with constant temperature control

A technology of thermal drive and constant temperature control, which is applied in the field of micro-electromechanical systems, can solve problems such as limited compensation range, and achieve the effects of small response time, high precision of constant temperature control, and small area

Active Publication Date: 2017-08-15
无锡微文半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Algorithmic compensation has a limited range of compensation

Method used

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  • A thermally driven mems device with constant temperature control
  • A thermally driven mems device with constant temperature control
  • A thermally driven mems device with constant temperature control

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as Figure 1 ~ Figure 3 As shown, the thermally driven MEMS device with constant temperature control includes a movable structure 1 inside the chip, a substrate 2 and a constant temperature insulation ring 3, and the movable structure 1 inside the chip includes a driving structure 1-1 and a braking structure 1- 2. The driving structure 1-1 is located around the braking structure 1-2. The constant temperature and heat insulating ring 3 includes a constant temperature ring 3-1 and two heat isolating rings 3-2. The A heat isolating ring 3-2a is insulated from the B heat The rings 3-2b are located on both sides of the constant temperature ring 3-1, the A thermal isolation ring 3-2a is connected to the substrate 2, and the B thermal isolation ring 3-2b is connected to the braking structure 1-2.

[0033] For the constant temperature and heat insulation ring 3 structure of this embodiment, the constant temperature ring 3-1 and the thermal insulation ring 3-2 are arranged ...

Embodiment 2

[0041] The constant temperature heat insulating ring 3 can have various design structures, and can make a resistor integrating heating and temperature measuring functions. The gap can be the minimum etching groove width in the process, and the temperature measuring resistor can accurately test the temperature rise generated by the heating resistor.

[0042] Such as Figure 8 As shown, in this embodiment, the heating resistor 3-1-2 and the temperature measuring resistor 3-1-3 are combined into one temperature control resistor 3-1-4 to realize the heating and temperature measuring function.

[0043] The constant temperature ring 3-1 includes a heat conduction base 3-1-1 and a temperature control resistor 3-1-4, and the temperature control resistance 3-1-4 is installed on the heat conduction base 3-1-1. The thermally conductive substrate 3-1-1 is preferably monocrystalline silicon, and the temperature control resistor 3-1-4 is preferably made of a material with a high temperature...

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PUM

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Abstract

A thermally driven MEMS device with thermostatic control is provided, comprising a chip internal movable structure 1 and a substrate 2, as well as a thermostatic insulating ring 3. The chip internal movable structure 1 is connected to the substrate 2 through the thermostatic insulating ring 3. The thermostatic insulating ring 3 comprises at least one thermostatic ring 3-1 and at least two thermal insulating rings 3-2, wherein the thermal insulating ring 3-2a and the thermal insulating ring 3-2b are located at two sides of the thermostatic ring 3-1. The thermal insulating ring 3-2a is connected to the substrate 2, and the thermal insulating ring 3-2b is connected to the chip internal movable structure 1. The device is advantageous in that a thermostatic control function module is integrated on a chip, and the module occupies a small size, consumes low power, small responses in less time, and achieves high temperature control precision. The device also integrates the advantages of a ring shape thermostatic control MEMS chip which is small in size, consumes less power and costs and can be manufactured in batches.

Description

technical field [0001] The invention relates to a thermally driven MEMS device with constant temperature control, which belongs to the technical field of micro-electromechanical systems. Background technique [0002] Thermal MEMS devices are widely used in civil products, industrial products, Internet of Things and other fields, but their operating temperature is -55°C~125°C, which has a huge impact on the stability of thermal MEMS devices, because thermal The sensitive factor of conventional MEMS devices is temperature. [0003] In order to solve the test error of the thermal MEMS device introduced by the fluctuation of the ambient temperature, it is necessary to compensate the temperature, which can be controlled by adding TEC temperature or algorithm compensation. The TEC increases the size of the system, requires a large power consumption for the overall constant temperature of the chip, and increases the cost. For example, the patent application number 201210268441.0,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00
CPCB81B7/0087B81B7/0096
Inventor 丁金玲陈巧谢会开
Owner 无锡微文半导体科技有限公司