Vacuum processing device, vacuum processing method, and computer-readable storage medium

Abstract

A vacuum processing device comprises a spare vacuum chamber in which the internal pressure is capable of switching between normal pressure and reduced pressure and into / out of which a substrate is carried, plural processing chambers in which various kinds of processing are performed on the substrate, a substrate transfer chamber by which the spare vacuum chamber and the plural processing chambers are connected and which includes a substrate transfer mechanism for transferring the substrate between the spare vacuum chamber and the plural vacuum processing chambers and a recess formed in a bottom portion or a ceiling portion, an auxiliary module in which predetermined processing is performed on the substrate transfer mechanism, and a lifting mechanism for moving the auxiliary module between a first position at which the auxiliary module is housed in the recess so as not to interfere with the transfer of the substrate by the substrate transfer mechanism and a second position at which the substrate is carried into / out of the auxiliary module by the substrate transfer mechanism.

Description

technical field [0001] The present invention relates to a vacuum processing device, a vacuum processing method using the vacuum processing device, and a computer-readable storage medium storing a computer for causing the vacuum processing device to execute the vacuum processing method. The process chamber is connected to the vacuum transport chamber having the substrate transport unit so that the plurality of vacuum process chambers can be effectively used. Background technique [0002] When manufacturing a semiconductor device, a semiconductor wafer (hereinafter referred to as "wafer") as a semiconductor substrate is subjected to predetermined vacuum processing including etching processing, film forming processing, ashing processing, and the like. As an apparatus for performing these steps, a so-called multi-chamber vacuum processing apparatus is known in which a plurality of vacuum processing chambers are connected to a common transfer chamber that can maintain a vacuum, a...

AI Technical Summary

Problems solved by technology

However, under such a structure, the following problems arise: the footprint of the device becomes large, and the throughput of the second conveying arm 14 decreases due to the large moving area of ​​the second conveying arm 14.

Therefore, even with the configuration disclosed in Document 1, the problem of the present invention cannot be solved.

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