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Structure for compositing wafers in inner caps

An internal compounding and wafer technology is applied in the field of the structure of inwardly covering the inner compounding wafer, which can solve the problems of low production efficiency and low operation efficiency of the production line, and achieve the effect of improving production efficiency.

Inactive Publication Date: 2016-11-09
SUZHOU HYCAN HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The inner ring of the existing metal cover needs to be inserted into the structure of the sealing ring. After the sealing ring is formed piece by piece, the sealing ring is put into the metal cover manually or mechanically, and then the sealing cover and the metal cover are tightly combined. Operational inefficiency, making the entire production line inefficient

Method used

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  • Structure for compositing wafers in inner caps
  • Structure for compositing wafers in inner caps
  • Structure for compositing wafers in inner caps

Examples

Experimental program
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Effect test

specific Embodiment 2

[0023] Embodiment 2: When the raw material structure 3 is a rectangular plate with a fixed size, each plate is transferred out of the bottom of the punching die as a whole after stamping is completed, and then replaced with a new plate.

[0024] Its working principle is as follows: Lay the raw material structure on the plane of the lower punching die, lay the inner cover of the cover upwards on the cover laying platform, and set a cover directly below each lower knife edge to act as the upper knife edge After being heated to a suitable temperature by the heating coil, the upper knife edge is driven downward by the punch, and with the assistance of the lower knife edge, the raw material structure is punched to form a raw material sealing sheet, and then the upper knife edge continues to move downward until it is pressed The corresponding raw material sealing sheet is closely attached to the inner cover of the lid directly below. Since the temperature of the upper knife edge can ...

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Abstract

The invention provides a structure for compositing wafers in inner caps. By means of the structure, sealing structures can be rapidly composited in the inner caps, and the production efficiency is improved. The structure for compositing the wafers in the inner caps comprises a punching head on the upper portion and a lower punching cutting die on the lower portion, a raw material structure is laid at the upper end of the lower punching cutting die, the lower punching cutting die is internally provided with multiple lower cutting edges, the position over each lower cutting edge is provided with a corresponding upper cutting edge, the top of each upper cutting edge is fixedly installed at the lower end of the punching head, a heating coil is arranged on the outer ring surface of the lower portion of each upper cutting edge, a cover laying table is arranged below the lower punching cutting die, covers are laid on the cover laying table, the inner caps of the covers face upwards, one cover is arranged on the portion under each lower cutting edge, and each upper cutting edge can penetrate through a cavity of the corresponding lower cutting edge in the vertical direction.

Description

technical field [0001] The invention relates to the technical field of making metal containers, and in particular relates to a structure of composite discs with an inner lid. Background technique [0002] The inner ring of the existing metal cover needs to be inserted into the structure of the sealing ring. After the sealing ring is formed piece by piece, the sealing ring is put into the metal cover manually or mechanically, and then the sealing cover and the metal cover are tightly combined. The operating efficiency is low, making the production efficiency of the entire production line low. Contents of the invention [0003] In view of the above problems, the present invention provides a structure for compounding wafers in the inner cover, which allows the sealing structure to be quickly compounded in the inner cover and improves production efficiency. [0004] A structure for compounding discs with an inner cover, characterized in that it includes an upper punch and a l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D51/46
CPCB21D51/46
Inventor 黄小林沈俊杰程立斌孔祯焕
Owner SUZHOU HYCAN HLDG CO LTD
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