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High-adhesion-force enameled wire and production method thereof

A technology with high adhesion and production method, applied in conductors, insulated cables, electrical components, etc., can solve the problems of easy peeling of paint film, poor use effect, single paint film, etc., to reduce material costs and pinholes opportunity, the effect of improving adhesion

Inactive Publication Date: 2016-11-16
先登高科电气股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, when most enterprises produce enameled wires, due to the simple process and single paint film, the paint film is easy to fall off when winding the coil, and the use effect is not good.

Method used

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  • High-adhesion-force enameled wire and production method thereof

Examples

Experimental program
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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, but it is not used as a basis for limiting the present invention.

[0026] Example. High adhesion enameled wire, constituted as figure 1 As shown, it includes a copper round wire 1, and the surface of the copper round wire 1 is sequentially provided with an adhesive layer 2, a polyesterimide resin paint layer 4 and a polyamideimide resin paint layer 5 from the inside to the outside, and the thickness of the adhesive layer 2 is : Thickness of polyesterimide resin paint layer 4: thickness of polyamideimide resin paint layer 5=1:6:5.

[0027] A nylon layer 3 is provided between the adhesive layer 2 and the polyesterimide resin paint layer 4 .

[0028] The thickness of the nylon layer 3 is 0.001mm-0.003mm.

[0029] The total thickness of the adhesive layer 2, polyesterimide resin paint layer 4 and polyamideimide resin paint layer 5 is 0.078mm-0.081mm. Pol...

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Abstract

The invention discloses a high-adhesion-force enameled wire and a production method thereof. The enameled wire comprises a copper round wire (1). A binding layer (2), a polyesterimide resin paint layer (4) and a polyamideimide resin paint layer (5) are successively on the surface of the copper round wire (1) from inside to outside. The thickness of the binding layer (2), the thickness of the polyesterimide resin paint layer (4) and the thickness of the polyamideimide resin paint layer (5)=1:6:5. The high-adhesion-force enameled wire has advantages of high adhesion force, no easy falling of an insulating paint layer and relatively high use effect.

Description

technical field [0001] The invention relates to a copper round enameled wire, in particular to a high adhesion enameled wire and a production method thereof. Background technique [0002] With the continuous progress and development of industrial society, the application range of enameled wire is more and more extensive, the demand for it is increasing, the requirements for variety and performance are getting higher and higher, and more and more requirements are put forward for the supporting raw materials and components. This brings both opportunities and challenges to the development of basic industries such as raw materials and components. At present, when most enterprises produce enameled wires, due to the simple process and single paint film, the paint film is easy to fall off when winding the coil, and the use effect is not good. Contents of the invention [0003] The object of the present invention is to provide a high adhesion enameled wire and a production method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B7/04H01B7/17H01B7/18H01B13/00H01B13/30
CPCH01B7/17H01B7/04H01B7/188H01B13/00H01B13/30
Inventor 张市明杨震姚斌华
Owner 先登高科电气股份有限公司