A guide rail device for semiconductor valve serial pressure assembly integration

Abstract

The invention provides a guide rail apparatus for semiconductor valve string press mounting integration. The guide rail apparatus comprises a horizontally arranged guide rail. Semiconductor supporting seats and heat radiator supporting seats are assembled on the guide rail in a guide movement way. The numbers and sequences of the semiconductor supporting seats and the heat radiator supporting seats are consistent with that of the corresponding device in a semiconductor valve string to be pressed. The guide rail apparatus has the advantages that the semiconductors and radiators in the valve string can be horizontally placed in order according to a sequence, compared with a placement method of vertical accumulation, a transmission path is reduced according to the placement method of the invention, thus the labor intensity is low, and the assembling efficiency is high at the same time. Furtherly, the assembling precision of the valve string is guaranteed depend on the respective supporting seat of the semiconductors and radiators, compared with a placement mode that a lower device is used as the reference of an upper device in vertical accumulation, the tolerance accumulation is not formed, the assembling precision is raised, thus the difference of semiconductor valve strings of a same model is small, and the standardization degree of an integration module is high.

Description

technical field [0001] The invention relates to a guide rail device for press-fitting and integrating semiconductor valve strings. Background technique [0002] At present, my country has completed the South Australia three-terminal ±160kV and Zhoushan five-terminal ±200kV flexible DC transmission projects, but due to the lack of core equipment - DC circuit breakers, the advantages of these projects have not been brought into play. The DC circuit breaker is the core equipment in the flexible DC transmission project, mainly composed of crimped IGBT packaging modules. [0003] At present, when large-scale semiconductor devices such as IGBTs are modularized and integrated, manual stacking and vertical pressing are mainly used. The authorized announcement number is CN204832258U. Connected IGBT package module press-fit test fixture, including the first fixed plate set, the first conductive plate, the first water-cooled heat dissipation set, the second conductive plate, the secon...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a guide rail device for semiconductor valve series press-fit integration to solve the problems of low assembly accuracy and high labor intensity caused by manual vertical stacking of devices in the prior art

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