Package structure and manufacturing method thereof

Abstract

The invention provides a packaging structure and a manufacturing method thereof. The packaging structure comprises a chip, a blocking structure and a substrate, wherein the chip comprises a base material and a photosensitive part, and the photosensitive part is positioned on the base material; the blocking structure is arranged on the chip and comprises a first frame surrounding part, a second frame surrounding part and a terraced opening, the first frame surrounding part and the second frame surrounding part form a frame surrounding photosensitive part together so as to be defined into the terraced opening, the terraced opening is exposed out of the photosensitive part, and the first frame surrounding part is positioned on the base material and is protruded out of the second frame surrounding part; and the substrate is arranged on the blocking structure, and the chip and the blocking structure are covered with the substrate. The process yield can be effectively improved, and the overall reliability of the packaging structure is improved.

Description

technical field [0001] The present application relates to a packaging structure and a manufacturing method thereof, and in particular to a chip packaging structure and a manufacturing method thereof. Background technique [0002] In recent years, due to the vigorous development of multimedia, the use of digital images has become more and more frequent, correspondingly, the demand for many image processing devices has also increased. Nowadays, many digital picture products, including web cameras, digital cameras, even optical scanners and picture phones, etc., all acquire pictures through image sensors. The image sensor includes a charge-coupled device image sensor chip (CCD image sensor chip) and a complementary metal oxide semiconductor image sensor chip (CMOS image sensor chip), etc., which can sensitively receive light emitted by a scene (scene) The light is converted into a digital signal. Because these image sensor chips need to receive light sources, their packaging ...

AI Technical Summary

Problems solved by technology

However, since the barrier structure must have a certain thickness to maintain its supporting force and structural strength, in this case, when removing part of the barrier layer covering the chip, it is difficult to remove it completely because of its thick thickness, so it is easy to have residual Residues between the barrier structure and the photosensitive part will affect the yield of the process, or the distance between the barrier structure and the photosensitive part needs to be increased to maintain a certain safety distance. However, this method will limit the width of the barrier structure, thereby affecting Reliability of Package Structure

Images